Mission-critical applications,High Availability Storage,Appliance PlatformTwo hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:
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2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
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Intel® C621 chipset
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16 DIMM slots, Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
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2 PCI-E 3.0 x16 slots
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Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN
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4 Hot-swap 2.5" SATA3 drive bays
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Broadcom 3008 SAS3 controller; SW RAID
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2 SuperDOM onboard or optional,2 M.2 carrier
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Up to 1000W Redundant Power Supplies Titanium Level (96%)
Processor/Cache
Processor
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s,Dual UPI up to 10.4GT/s Support CPU TDP 70-145W, Up to 28 Cores Note : BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors
Chipset
Chipset
Intel® C621 chipset
System Memory
Memory Capacity
16 DIMM slots, Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Expansion Slots
PCI-Express
2 PCI-E 3.0 x16 Low-profile slots,1 SIOM card support
Integrated On-Board
SAS
Broadcom 3008 SAS3 (12Gbps) controller;SW RAID 0, 1, 10 support
LAN
1 RJ45 Dedicated IPMI LAN port
Add-on Options
Optical Drive
None
Front Panel
Front Panel
Power status LED, HDD activity LED,Network activity LEDs,Universal Information (UID) LED
Buttons
Power On/Off button, UID button
Drive bays
HDD Drives
4 Hot-swap 2.5" SAS3/SATA3 drive bays
Power Supply
Power Supply
1000W Redundant Power Supplies Titanium Level (96%)
Cooling System
Cooling System
3 Heavy duty counter rotating fans with air shroud and optimal fan speed control
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
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