2U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s"
Intel ®C621 chipset
"Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);"
8 Hot-swap 3.5" SATA drive bays
4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots
600W platinum efficiency multiple output power supply
Octa Socket P (LGA 3647)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors.
8S-3 UPI up to 10.4GT/s
Support CPU TDP 70-205W
Up to 28 Cores
Intel ®C621 chipset
4U/Full Tower
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Single Socket H4 (LGA 1151),CPU TDP support up to 95W
Support Intel® Xeon® processor E-2100 / E-2200 series, 8th/9th Gen. Intel® Core™ i9/i7/i5/i3 Processors, Intel® Celeron®, Intel® Pentium®
Up to 8-Cores
Intel® C246 chipset
4 DIMM slots
4 Fixed 3.5", Opt. 4 2.5" drive bays, 2 Standard 5.25" drive bays,1 Fixed 3.5" device bay
2 PCI-E 3.0 x16 running at NA/16 or 8/8,1 PCI-E 3.0 x4 slot,1 PCI-E 3.0 x1 slot
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 512GB Registered ECC RDIMM
12 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
Tower/Convertible/Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
3U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 512GB Registered ECC RDIMM
16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
8 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays/Hot swap bays
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
8 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays/Hot swap bays
Tower/Convertible/Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
4 PCI-E 3.0 x16,2 PCI-E 3.0 x8
500W/1200W Single power supply 80 Plus Platinum Certified
Tower/Convertible/5U Rackmount
Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required),Socket SP3 Up to 240W TDP Up to 32 Cores
System on Chip
2TB Registered ECC DDR4 ,2666MHz SDRAM in 16 DIMMs
External: 5.25" x 4, 3.5" x 1 ,Internal: 3.5" or 2.5" x 5
5U rack-mount
Intel® 8th/9th Generation Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® series Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 95W TDP
Intel® Q370
Up to 64GB Unbuffered non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots
5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
5U rack-mount
Intel® 8th/9th Generation Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® series Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 120W TDP
Intel® Z390 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2 PCI-E 3.0 x16 slots (16/NA or 8/8),
1 PCI-E 3.0 x4,3 PCI-E 3.0 x1
CPU Slot3 PCI-E 3.0 x8 (IN x16) slot and CPU Slot1 PCI-E 3.0 x4 slot share the same PCI-Ex16 link with CPU Slot6 PCI-E 3.0 x16 slot. CPU Slot6 PCI-E 3.0 x16 slot and CPU Slot3 PCI-E 3.0 x8 (IN x16) slot will change to PCI-E 3.0 x8 link and PCI-E 3.0 x4 link respectively when an add-on card is installed in CPU Slot1 PCI-E 3.0 x4 slot,M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1,M.2 Form Factor: 2242/2260/2280/22110, 2242/2260/2280
M.2 Key: M-Key, M-Key
Mid-tower
Intel® Xeon® Processor Skylake-W , Intel® Xeon® Processor W Family., Single Socket R4 (LGA 2066) supported, CPU TDP support Up to 140W
Intel® C422
Up to 256GB Registered ECC RDIMM, DDR4-2666MHz; Up to 512GB Registered ECC LRDIMM, in 8 DIMM slots
6 x 3.5" fixed drive bay,4 x 2.5" fixed drive bay
3 PCI-E 3.0 x16,1 PCI-E 3.0 x4,3xPCI-E3.0 x16 Slots(8/16/16,1xPCI-E3.0x4
M.2 Interface: 2 PCI-E 3.0 x4,M.2 Form Factor: 22110,M.2 Key: M-Key (RAID 0,1 support),M-Key for SSD and Optane(up to Intel POR). Intel VROC licence kit is needed to enable RAID.,U.2 Interface: 2 PCI-E 3.0 x4
Tower/Convertible/5U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C622
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
Tower/Convertible/5U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C622
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C622 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots(2933MHz in two DIMMs per channel supported on Rev 1.10 MB only) ;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
Tower/Convertible/5U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
Intel® C621 Chipset
"Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2 PCI-E 3.0 x8 (in x16 slot),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8 slot)
M.2 :M.2 Interface: PCI-E 3.0 x4 and SATA,Form Factor: 2280, 22110,Key: M-Key,Double Height Connector
Tower/Convertible/5U Rackmount
8th Generation Intel® Core™ i7(8086K and 8700K are not supported) /i5/i3/Pentium®/Celeron® Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 120W TDP
Intel® Z370 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
Tower/Convertible/5U Rackmount
8th Generation Intel® Core™ i7(8086K and 8700K are not supported)/i5/i3/Pentium®/Celeron® Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 120W TDP
Intel® Z370 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
12 x 3.5" hot-swap SAS/SATA drive bay with SES3
Expansion slots:2 PCI-E 3.0 x8 (in x16),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8)
920W Redundant Platinum Super Quiet power supply W/PMbus
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Quad Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 12TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 12TB 3DS ECC LRDIMM, DDR4-2933MHz, in 48 DIMM slotsUp to 12TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM in 48 DIMM slots; Up to 12TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
24 Hot-swap 3.5" SAS3/SATA3 drive bays Optional 24 SAS3 ports via AOC Optional 16 SAS3 ports via AOC + 8 NVMe ports via AOC
1 PCI-E 3.0 x32 Left Riser. 1 PCI-E 3.0 x40 Ultra Riser. 1 PCI-E 3.0 x8 in x16 slot rear Middle Riser. 1 PCI-E 3.0 x32 for 2U (or x48+x8 for 4U) on front for NVMe card support. 1 PCI-E 3.0 (x32 for 2U or x48 for 4U) on front for NVMe card support.
1600W (3+1) Redundant Power Supplies Platinum Level (96%)
3U Rack-mount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
24 x 2.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay
4U Rackmount
Intel® Xeon® Processor Skylake-W , Intel® Xeon® Processor W Family.
Single Socket LGA-2066 (Socket R4) supported, CPU TDP support Up to 140W TDP
Intel® C422
Up to 256GB Registered ECC RDIMM, DDR4-2666MHz; Up to 512GB Registered ECC LRDIMM, DDR4-2666MHz, in 8 DIMM slots
8 x 3.5" hot-swap SAS/SATA drive bay with SGPIO
3 PCI-E 3.0 x16,1 PCI-E 3.0 x4,3xPCI-E3.0 x16 Slots(8/16/16 (Skylake-W 48 lanes), 1xPCI-E3.0x4 slots,M.2 Interface: 2 PCI-E 3.0 x4,Form Factor: 22110,Key: M-Key (RAID 0,1 support),M-Key for SSD and Optane(up to Intel POR). Intel VROC licence kit is needed to enable RAID.
Mid-tower Rackmount
Intel® 8th/9th Generation Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® series Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 95W TDP
Intel® Q370
Up to 64GB Unbuffered non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots
4 x 3.5" fixed drive bay, Optional 4 x 2.5" fixed drive bay
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only)
10 x 2.5" hot-swap SAS/SATA drive bay
1 PCI-E 3.0 x32 Left Riser Slot,
1 PCI-E 3.0 x16 Right Riser Slot,
1 PCI-E 3.0 x16 for Add-On-Module (AOM)
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2242, 2260, 2280, 22110
M.2 Key: M-Key
700W/750W Platinum Power Supply W/PMbus W437xL597xH43mm
4U Rackmount
8th Generation Intel® Core i7(8086K and 8700K are not supported) /i5/i3/Pentium®/Celeron® Processor.Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 120W TDP
Intel® Z370 Express
Up to 64GB Unbuffered non-ECC UDIMM, DDR4-up to 3000+ MHz (OC), in 4 DIMM slots
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz Or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots; Xeon-W 32xx supports up to 2TB 3DS ECC RDIMM/LRDIMM, Xeon-W 32xx supports up to 1TB 3DS RDIMM/LRDIMM. ;Xeon-W32xx series processors don't support DCPMM.
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
4 PCI-E 3.0 x16,
3 PCI-E 3.0 x8 (in x16 slot),
PCI-Ex16 Slot#1 shares with M.2, Slot#2 shares with Slot#3(NA/16,8/8), Slot#4 shares with Slot#5(NA/16,8/8), Slot#6 shares with Slot#7(NA/16,8/8)
(16/NA/16/NA/16/NA/16 or 16/8/8/8/8/8/8)
M.2 Interface: 4 PCI-E 3.0 x4, RAID 0 & 1
M.2 Form Factor: 2242/2260/2280/22110
M.2 Key: M-Key
M.2 shares PCI-E lanes with PCI-Ex16 slot#1, VROC key is required for Raid.
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz Or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots; Xeon-W 32xx supports up to 2TB 3DS ECC RDIMM/LRDIMM, Xeon-W 32xx supports up to 1TB 3DS RDIMM/LRDIMM. ;Xeon-W32xx series processors don't support DCPMM.
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
4 PCI-E 3.0 x16,
3 PCI-E 3.0 x8 (in x16 slot),
PCI-Ex16 Slot#1 shares with M.2, Slot#2 shares with Slot#3(NA/16,8/8), Slot#4 shares with Slot#5(NA/16,8/8), Slot#6 shares with Slot#7(NA/16,8/8)
(16/NA/16/NA/16/NA/16 or 16/8/8/8/8/8/8)
M.2 Interface: 4 PCI-E 3.0 x4, RAID 0 & 1
M.2 Form Factor: 2242/2260/2280/22110
M.2 Key: M-Key
M.2 shares PCI-E lanes with PCI-Ex16 slot#1, VROC key is required for Raid.
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
4U Rackmount
Intel® Xeon® Scalable Processors, Intel® Xeon® W-32xx Processor.
Single Socket LGA-3647 (Socket P) supported, CPU TDP support 205W TDP
Intel® C621
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz Or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots;Xeon-W 32xx supports up to 2TB 3DS ECC RDIMM/LRDIMM, Xeon-W 32xx supports up to 1TB 3DS RDIMM/LRDIMM. ;Xeon-W32xx series processors don't support DCPMM.
5 x 3.5" hot-swap SAS3/SATA drive bay
4 PCI-E 3.0 x16,
3 PCI-E 3.0 x8 (in x16 slot),
PCI-Ex16 Slot#1 shares with M.2, Slot#2 shares with Slot#3(NA/16,8/8), Slot#4 shares with Slot#5(NA/16,8/8), Slot#6 shares with Slot#7(NA/16,8/8)
(16/NA/16/NA/16/NA/16 or 16/8/8/8/8/8/8),M.2 Interface: 4 PCI-E 3.0 x4, RAID 0 & 1
M.2 Form Factor,2242/2260/2280/22110
M.2 Key: M-Key,M.2 shares PCI-E lanes with PCI-Ex16 slot#1, VROC key is required for Raid.
800W Redundant Power Supplies Platinum Level (94%)
2U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)Socket SP3, Support CPU TDP / cTDP up to 200W*, Up to 64 Cores
Note : Certain CPUs with high TDP may be supported only under specific conditions. Please contact TyroneTechnical Support for additional information about specialized system optimization
System on Chip
Up to 4TB ECC 3DS LRDIMM,up to DDR4-3200MHz; 16 DIMM slots
2U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor
(7003 Series Processor drop-in support requires BIOS version 2.0 or newer)Socket SP3, Supports CPU TDP / cTDP up to 280W, Up to 64 Cores
Note : Certain CPUs with high TDP may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
System on Chip
Up to 2TB ECC 3DS LRDIMM,up to DDR4-3200MHz; 8 DIMM slots
3 Hot-swap 3.5" SATA3 drive bays
2 PCI-E 4.0 (x16) Low-profile slots,1 SIOM card support
(must bundle with network card)
M.2 Interface: 1 SATA/PCI-E 3.0 x4, Form Factor: 2280, 22110
Key: M-key
2000W Redundant Power Supplies Titanium Level (96%)
1U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Support CPU TDP up to 280W, Up to 64 Cores
System on Chip
8 DIMMs; up to 2TB 3DS ECC,DDR4-3200MHz RDIMM/LRDIMM
1U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer),Socket SP3 Support CPU TDP up to 280W, Up to 64 Cores
System on Chip
8 DIMMs; up to 2TB 3DS ECC, DDR4-3200MHz RDIMM/LRDIMM
10 Hot-swap 2.5" SATA3 drive bays
Optional 2 U.2 NVMe (PCI-E 3.0) drive support via additional kit for NVMe devices
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only);
8 x 3.5" hot-swap SAS3/SATA drive bay
2 x 3.5" fixed drive bay
1U Rackmountable
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
8 x 2.5" hot-swap SAS/SATA drive bay
2 PCI-E 3.0 x8 (in x16 slot),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8 slot)
M.2 :M.2 Interface: PCI-E 3.0 x4 and SATA,Form Factor: 2280, 22110,Key: M-Key,Double Height Connector
1U 600W Redundant Single Output Power Supply w/PMBus, short depth, W54.5xL220xH40
5U Rackmount/Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only);
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
5U Rackmount/Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only);
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s"
Intel® C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
4 Hot-swap 2.5" SAS3/SATA3 drive bays
2 PCI-E 3.0 x16 Low-profile slots, 1 SIOM card support
1000W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required),Socket SP3, Up to 32 Cores, Up to 64 Cores (Board revision 2.x required)
"
System on Chip (SoC)
1U Rackmount
"Intel® Xeon® processor D-2146NT, CPU TDP support 80W, 8 Cores, 16 Threads
"
System on Chip (SoC)
Up to 512GB DDR4 ECC LRDIMM, Up to 256GB DDR4 ECC RDIMM 4 DIMM slots
Memory Type :2666/2400/2133MHz ECC DDR4 L/RDIMM
Operating speed up to 2133MHz
2x 2.5"" drive bays (one drive space shares with M.2)
4 PCI-E 3.0 x8 slots for AIOM (AIOM is sold separately, it is not included in this standard/barebone system)
M.2
2 M.2 M-Key 2280/22110 (space share with one 2.5"" drive bay)
1 M.2 E-Key 2230
1 M.2 B-Key 3042
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
8 x 3.5"" hot-swap SAS3/SATA drive bay, 2 x 3.5"" fixed drive bay
5U Rackmount/Tower
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
5U Rackmount/Tower
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
Tower/Convertable/ 5U Rackmount
Intel® Xeon® W-2100 Processors., Single Socket LGA-2066 (Socket R4) supported, CPU TDP support Up to 140W TDP
Intel® C422
Up to 256GB ECC RDIMM, DDR4-2666MHz; Up to 512GB ECC LRDIMM, DDR4-2666MHz, in 8 DIMM slots
Drive bays:External:5.25" x 4, 3.5" x 1,Internal: 3.5" or 2.5" x 5
Tower/Convertable/ 5U Rackmount
Intel® Xeon® W-2100 Processors., Single Socket LGA-2066 (Socket R4) supported, CPU TDP support Up to 140W TDP
Intel® C422
Up to 256GB ECC RDIMM, DDR4-2666MHz; Up to 512GB ECC LRDIMM, DDR4-2666MHz, in 8 DIMM slots
Drive bays:External:5.25" x 4, 3.5" x 1,Internal: 3.5" or 2.5" x 5
2U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s"
Intel® C621 chipset
"Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);"
4 Hot-swap 2.5"" NVMe/SATA3 + 2 Hot-swap 2.5"" SATA3 drive bays
M.:21 M.2 NVMe or SATA (2280/22110)
2U Rackmount
Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
16 x 2.5" hot-swap SAS3/SATA drive bay, 1 x 5.25" drive bay
4U Rackmount/Tower
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
10U Rackmount
"Dual Socket P (LGA 3647)Intel® Xeon® Scalable Processors,
3 UPI up to 10.4GT/s, Support CPU TDP 205W, Cores Up to 28 Cores, GPU Supports 16 V100 SXM3 350W
"
Intel® C621 chipset
24 DIMM slots, Up to 3TB 3DS ECC L/RDIMM, up to DDR4-2666MHz
Memory Type 2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
16 Hot-swap 2.5"" NVMe drive bays *
6 Hot-swap 2.5"" SATA3 drive bays
M.2
M.2 Interface: 2 PCI-E 3.0 x4
Form Factors: 2280, 22110
Key: M-Key
Note * NVMe hot-swap feature doesn't work in Windows environment
16 PCI-E 3.0 x16 for RDMA via IB EDR
2 PCI-E 3.0 x16 on motherboard
6x (5+1) 3000W Redundant Power
Supplies; Titanium Level (96%+)
4U Rackmount
Single Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡
Intel® Xeon® W-32xx Processors
Support CPU TDP up to 205W
Up to 28 Cores BIOS version 3.0b or above is required to support 2nd Gen. Intel® Xeon® Scalable processors
Intel® C621
12 DIMM slots
Intel® Xeon® Scalable Processors: Support up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots.
Intel® Xeon® W-3200 Processors: Support up to 2TB 3DS ECC RDIMM/LRDIMM; up to 1TB 3DS RDIMM/LRDIMM. (Xeon® W-3200 doesn't support DCPMM.)
Mid Tower
"Single Socket H4 (LGA 1151),CPU TDP support up to 95W Support Intel® Xeon® processor E-2100 / E-2200 series,
8th Gen. Intel® Core™ i3 Processors,
Intel® Celeron®, Intel® Pentium®
"
Intel® C242 chipset
4 DIMM slots Up to 128GB ECC UDIMM
Up to DDR4-2666MHz Memory Type
2666/2400/2133MHz ECC DDR4 SDRAM
DIMM Sizes 32GB, 16GB, 8GB
Note: Future support for 128GB via BIOS update expected in early 2019
Tower/5U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
"
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 6TB Intel® Optane™ Persistent Memory, DDR4-3200MHz, in 16 DIMM slots;
Up to 6TB Intel® Optane DC Persistent Memory in memory mode."
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
Tower/Convertible/5U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
"Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Note : BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP
"
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
16 x 3.5"" hot-swap SAS3/SATA drive bay
Optional 2 x 2.5"" hot-swap SAS3/SATA drive bay
4U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required), Socket SP3
Cores Up to 32 Cores Up to 64 Cores (Board revision 2.x required)
"
System on Chip
4U Rackmount
"
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
"
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
1U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Up to 28 Cores Note : BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors"
" Intel® C621 chipset
"
24 DIMM slots
Up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only);
36 x 3.5"" hot-swap SAS/SATA drive bay with SES3
Optional 2 x 2.5"" hot-swap drive bay
3U Rackmount
"Dual Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡,
3 UPI up to 10.4GT/s, Support CPU TDP 205W
"
Intel® C621
16 DIMM slots, Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
1U Rackmount
"Single AMD EPYC™ 7001/7002* series Processor (*Board revision 2.x required) Socket SP3
Supports CPU TDP 225W / cTDP up to 240W*
"
System on Chip (SoC)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
"Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
4 hot-swap 3.5" SATA3 drive bays
"2 PCI-E 3.0 x8 (in x16),
4 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)"
400W Redundant Power Supply Platinum with PMBUS, W54.5xL220xH40mm
Tower/Convertible/5U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
"Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
5U rack-mount
Intel® 8th/9th Generation Core i9/Core i7/Corei5/Corei3/Pentium®/Celeron® series Processor., Single Socket LGA 1151 supported, CPU TDP support Up to 140W
Intel® Z390 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
"4 PCI-E 3.0 x16 slots (16/NA/16/NA or 16/NA/8/8 or 8/8/16/NA or 8/8/8/8),1 PCI-E 3.0 x1, M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1 and 1 CNVi
M.2 Form Factor: 2260/2280/22110, 2260/2280, 2230, M.2 Key: M-Key, M-Key, E-Key (RAID 0,1 support)
M.2-M1 port shares PCI-E link with U2-1 port;M.2-M2 port shares link with SATA port4 and port5; M.2-E1 port pre-installed one 802.1ac WiFi+BT5.0 module
U.2 Interface: 2 PCI-E 3.0 x4 and PCI-E 3.0 x4"
5U rack-mount
Intel® 8th/9th Generation Core i9/Core i7/Corei5/Corei3/Pentium®/Celeron® series Processor., Single Socket LGA 1151 supported, CPU TDP support Up to 140W
Intel® Z390 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
"4 PCI-E 3.0 x16 slots (16/NA/16/NA or 16/NA/8/8 or 8/8/16/NA or 8/8/8/8),1 PCI-E 3.0 x1, M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1 and 1 CNVi
M.2 Form Factor: 2260/2280/22110, 2260/2280, 2230, M.2 Key: M-Key, M-Key, E-Key (RAID 0,1 support)
M.2-M1 port shares PCI-E link with U2-1 port;M.2-M2 port shares link with SATA port4 and port5; M.2-E1 port pre-installed one 802.1ac WiFi+BT5.0 module
U.2 Interface: 2 PCI-E 3.0 x4 and PCI-E 3.0 x4"
550/1200W Redundant power supply , 80Plus Platinum
4U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors,(7003 Series Processor drop-in support requires BIOS version 2.0 or newer)*
Socket SP3, Supports CPU TDP up to 280W, Up to 128 Cores (64 per CPU)
Note :Supports 2 CPUs only – single socket not supported, Certain CPUs with high TDP may be supported only under specific conditions. Please contact TyroneTechnical Support for additional information about specialized system optimization, 4U Dual Processor (AMD), Dual-Root GPU system with 8 PCI-E GPUs.
System on Chip
2U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer),Socket SP3, Supports CPU TDP up to 280W, Up to 128 Cores (64 per CPU)
Note :Certain CPUs with high TDP may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
GPU Supports HGX A100 4-GPU 40GB (HBM2) or 80GB(HBM2e) with NVLink GPU interconnect and PCI-E Gen4 host CPUs
System on Chip
"32 DIMM slots
Up to 8TB 3DS ECC DDR4-3200MH SDRAM
Memory Type
3200MHz ECC DDR4 SDRAM"
1U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
Intel ®C621 chipset
"Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
"
2 x 3.5"" fixed drive bay
SAS or enterprise SATA HDD only recommended
"
2U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors,(7003 Series Processor drop-in support requires BIOS version 2.0 or newer)Socket SP3, Supports CPU TDP up to 280W, Up to 64 Cores
Note : Certain CPUs with high TDP higher than 225W may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
System on Chip
8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
"12 hot-swap 3.5"" Drive Bays:
12 SATA3 by default
or 8 SATA3 + 4 NVMe via optional tray
or 12 SAS3 via optional SAS kit
"
1U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
Intel® C622 chipset
"Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
2U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
Intel® C622 chipset
"Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
8 x 3.5" hot-swap SAS3/SATA drive bay, 2 x 3.5" fixed drive bay
3U rack-mount
Intel® 8th/9th Generation Core i9/Core i7/Corei5/Corei3/Pentium®/Celeron® series Processor., Single Socket LGA 1151 supported, CPU TDP support Up to 140W
Intel® Z390 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
"4 x 3.5"" fixed drive bay
Optional 4 x 2.5"" fixed drive bay"
"4 PCI-E 3.0 x16 slots (16/NA/16/NA or 16/NA/8/8 or 8/8/16/NA or 8/8/8/8),1 PCI-E 3.0 x1, M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1 and 1 CNVi
M.2 Form Factor: 2260/2280/22110, 2260/2280, 2230, M.2 Key: M-Key, M-Key, E-Key (RAID 0,1 support)
M.2-M1 port shares PCI-E link with U2-1 port;M.2-M2 port shares link with SATA port4 and port5; M.2-E1 port pre-installed one 802.1ac WiFi+BT5.0 module
U.2 Interface: 2 PCI-E 3.0 x4 and PCI-E 3.0 x4"
2U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
Socket SP3, Up to 240W TDP
Up to 32 Cores
Up to 64 Cores (Board revision 2.x required)"
System on Chip
2U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
Socket SP3, Up to 240W TDP
Up to 32 Cores
Up to 64 Cores (Board revision 2.x required)"
System on Chip
2U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
Socket SP3, Up to 240W TDP
Up to 32 Cores
Up to 64 Cores (Board revision 2.x required)"
System on Chip
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
12 x 3.5" hot-swap drive bay, optional 2 x 2.5" hot-swap drive bay
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
12 x 3.5" hot-swap drive bay, optional 2 x 2.5" hot-swap drive bay
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
36 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
4U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Up to 64 Cores
System on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
4U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Up to 64 Cores
System on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
1U Racdkmount
Dual AMD EPYC™ 7003/7002 Series Processors (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) Socket SP3, Supports CPU TDP up to 280W*
Up to 64 Cores
Note * Certain CPUs with high TDP may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
System on Chip
"32 DIMM slots, Supports up to 8TB Registered ECC DDR4 3200MHz SDRAM
8-channel memory bus
For Dual CPUs: Recommended that memory be populated equally in adjacent memory banks
"
12 Hot-swap 2.5" U.2 NVMe drive bays
"WIO:1 PCI-E 4.0 x32 Left Riser Slot, 1 PCI-E 4.0 x16 Right Riser Slot Ultra:1 PCI-E 4.0 x40 Far Right Riser Slot
"
1200W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
"Single AMD EPYC™ 7001/7002* series Processor (*Board revision 2.x required) Socket SP3
Cores: Up to 32 Cores, Up to 64 Cores (Board revision 2.x required)"
System on Chip
"DIMM slots
Supports up to 1TB Registered ECC DDR4 2666MHz SDRAM in 8 DIMMs
Supports up to 2TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.x required)
8-channel memory bus
Memory Type:
DDR4 2666 MHz Registered ECC, 288-pin gold-plated DIMMs
DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs (Board revision 2.x required)
"
12 x 3.5" hot-swap SAS/SATA drive bay with SES3, Optional 2 x 2.5" hot-swap drive bays
2U Rackmount
10th Generation Intel® Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® Processor
Single Socket LGA-1200 (Socket H5) supported, CPU TDP support Up to 140W TDP
Intel® Z490
Up to 128GB Unbuffered non-ECC UDIMM, DDR4-2933MHz, in 4 DIMM slots 2933 MHz to 4000+MHz(OC) in four 288-pin memory slots.
8 x 3.5"" hot-swap SAS3/SATA drive bay
2 x 3.5"" fixed drive bay
Tower/Convertible/5U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
Socket SP3, Up to 240W TDP
Cores :Up to 32 Cores, Up to 64 Cores (Board revision 2.x required)
"
System on Chip
"
16 DIMM sockets
Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM
Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.x required)
8-channel memory bus
"
"External 5.25"" x 4, 3.5"" x 1
• Internal 2.5""/3.5"" x 5"
"3 PCI-E 3.0 x8, 2 PCI-E 3.0 x16
M.2 , Interface: 1 SATA/PCI-E 3.0 x2 (Platform with EPYC 7002 processor only supports PCI-E type M.2 module)
Form factor: 2280, 22110
Key: M-key
"
Tower/Convertible/5U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
Socket SP3, Up to 240W TDP
Cores :Up to 32 Cores, Up to 64 Cores (Board revision 2.x required)
"
System on Chip
"
16 DIMM sockets
Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM
Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.x required)
8-channel memory bus
"
"External 5.25"" x 4, 3.5"" x 1
• Internal 2.5""/3.5"" x 5"
"3 PCI-E 3.0 x8, 2 PCI-E 3.0 x16
M.2 , Interface: 1 SATA/PCI-E 3.0 x2 (Platform with EPYC 7002 processor only supports PCI-E type M.2 module)
Form factor: 2280, 22110
Key: M-key
"
550 / 1200W Redundant power supply ,80 Plus platinum
1U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Supports CPU TDP up to 280W, Up to 64 Cores
Note : Certain CPUs with high TDP higher than 225W may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
System on Chip
1U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor , (7003 Series Processor drop-in support requires BIOS version 2.0 or newer),Socket SP3, Support CPU TDP up to 280W,Up to 64 Cores
System on Chip
"16 DIMM slots, Up to 4TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM
Memory Type: DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs"
10 Hot-swap U.2 Gen4/Gen3 NVMe drive support, Optional 10 SATA3 drive support via additional SATA cables
2U Rackmount
"Dual Socket P (LGA 3647)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
3 UPI up to 10.4GT/s
Support CPU TDP 70-165W
Cores
Up to 28 Cores
Note: ‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)"
Intel® C621 chipset
"24 DIMM slots
Up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
Memory Type : 2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Tyrone
†† Cascade Lake only. Contact your Tyrone sales rep for more info"
Tower/Convertible/5U Rackmount
"10th Generation Intel® Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® Processor
Single Socket LGA-1200 (Socket H5) supported, CPU TDP support Up to 140W TDP"
Intel® Z490
"Up to 128GB Unbuffered non-ECC UDIMM, DDR4-2933MHz, in 4 DIMM slots
2933 MHz to 4000+MHz(OC) in four 288-pin memory slots.
"
"External 5.25"" x 4, 3.5"" x 1
• Internal 2.5""/3.5"" x 5"
Tower/Convertible/5U Rackmount
"10th Generation Intel® Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® Processor
Single Socket LGA-1200 (Socket H5) supported, CPU TDP support Up to 140W TDP"
Intel® Z490
"Up to 128GB Unbuffered non-ECC UDIMM, DDR4-2933MHz, in 4 DIMM slots
2933 MHz to 4000+MHz(OC) in four 288-pin memory slots.
"
"External 5.25"" x 4, 3.5"" x 1
• Internal 2.5""/3.5"" x 5"
Tower/Convertible/5U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Up to 64 Cores
System on Chip
"8 DIMM slots
Supports up to 2TB Registered ECC DDR4 3200MHz SDRAM
8-channel memory bus
"
"External 5.25"" x 4, 3.5"" x 1
• Internal 2.5""/3.5"" x 5"
4U Rackmount/Tower
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
"
"
8 x 3.5"" hot-swap SAS/SATA drive bay with SGPIO
"
2U Rackmount
"2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s"
Intel® C622
" Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz
Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only"
"
24 x 2.5"" hot-swap SAS/SATA drive bay
Optional 2 x 2.5"" hot-swap drive bay
"
2U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Support CPU TDP / cTDP up to 225W, Up to 64 Cores
Note * Certain CPUs with high TDP may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
System on Chip
4U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor(7003 Series Processor drop-in support requires BIOS version 2.0 or newer) Socket SP3, Up to 64 Cores
System on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
8x 3.5" SAS3/SATA3 Backplane for Hot-Swappable Drives
2U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor(7003 Series Processor drop-in support requires BIOS version 2.0 or newer) Socket SP3, Up to 64 Cores
System on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
"
12 x 3.5"" hot-swap SAS/SATA drive bay with SES3
Optional 2 x 2.5"" hot-swap drive bay
"
2U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor(7003 Series Processor drop-in support requires BIOS version 2.0 or newer) Socket SP3, Up to 64 Cores
System on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
"
8 x 3.5"" hot-swap SAS3/SATA drive bay
2 x 3.5"" fixed drive bay
"
4U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Supports CPU TDP up to 280W, Up to 128 Cores (64 per CPU)
System on Chip (SoC
s
8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
"6 Hot-swap U.2 NVMe 2.5"" drive bays
(4 via PCI-E switch, 2 via CPU ) "
" 8 PCI-E 4.0 x16 via PCI-E switch;
1 PCI-E 4.0 x 16 LP and 1 PCI-E 4.0 x8 LP via CPUs;
AIOM Support "
2200W Redundant Power Supply / 3000W Redundant Power Supply
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
"8 x 3.5"" hot-swap SAS3/SATA drive bay, 2 x 3.5"" fixed drive bay
"
4U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor(7003 Series Processor drop-in support requires BIOS version 2.0 or newer) Socket SP3, Up to 64 Cores
System on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
8 x 3.5/2.5" Hot-swap SSD/HDDs
SAS 12Gb/s /SATA 6Gb/s /NVMe Backplane Support
4U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor(7003 Series Processor drop-in support requires BIOS version 2.0 or newer) Socket SP3, Up to 64 Cores
System on Chip
2U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s"
Intel® C621 chipset
"Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);"
2U Rackmount
" Dual Socket P (LGA 3647)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
Dual UPI up to 10.4GT/s
Support CPU TDP 70-140W
"
Intel® C621 chipset
"8 DIMMs; up to 2TB 3DS ECC
DDR4-2933MHz† RDIMM/LRDIMM "
6 Hot-swap 3.5" SATA3 drive bays
"2 PCI-E 3.0 x8 (FH/HL) or 1 PCI-E 3.0
x8 (FH/HL) + 1 PCI-E 3.0 x4 (FH/HL)
+ 1 PCI-E 3.0 x 4 (LP) (8/8/0 or 8/4/4)"
"Up to 1200W Redundant Power Supplies
Titanium Level (96%)"
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor"
16 x 3.5" hot-swap SAS3/SATA drive bay, optional 2 x 2.5" hot-swap SAS3/SATA drive bay
2U Rackmount
"2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 140W TDP, 2 UPI up to 10.4 GT/s"
Intel® C621
"Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
"
"8 x 3.5"" hot-swap SAS3/SATA drive bay
2 x 3.5"" fixed drive bay
"
2U rack-mount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s"
Intel® C622
"Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);"
12 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
12 x 3.5" hot-swap drive bay, optional 2 x 2.5" hot-swap drive bay
1U Rackmount
"Single AMD EPYC™ 7001/7002* series Processor (*Board revision 2.x required) Socket SP3
Supports CPU TDP 225W / cTDP up to 240W*
"
System on Chip (SoC)
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
"
8 x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay
Optional 2 x 3.5"" fixed drive bay
Optional 2 x 2.5"" hot-swap SAS3/SATA drive bay
"
2U rack-mount
"2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
"
Intel® C621
"
8 x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay
Optional 2 x 3.5"" fixed drive bay
Optional 2 x 2.5"" hot-swap SAS3/SATA drive bay
"
4U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required), Socket SP3
Cores Up to 32 Cores Up to 64 Cores (Board revision 2.x required)
"
System on Chip
2U Racdkmount
Dual AMD EPYC™ 7003/7002 Series Processors, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Supports CPU TDP up to 280W, Up to 64 Cores
System on Chip
32 DIMM slots, Supports up to 8TB Registered ECC DDR4 3200MHz SDRAM, 8-channel memory bus
"24 hot-swap 2.5"" U.2 NVMe drive bays
Up to 24 SAS/SATA drives supported via optional SAS kit
"
2U Rackmount
"Quad Socket P (LGA 3647)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
3 UPI up to 10.4GT/s
Support CPU TDP up to 205W
"
Intel® C621
"48 DIMMs; up to 12TB 3DS ECC
DDR4-2933MHz† RDIMM/LRDIMM,
Supports Intel® Optane™ DCPMM"
2U Rackmount
EATX Server Board with dual Xeon Scalable processors
Intel C622
DDR4 2666 MHz RDIMM up to 768 GB (24 DIMMs)
"8 x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay Optional 2 x 3.5"" fixed drive bay
Optional 2 x 2.5"" hot-swap SAS3/SATA drive bay
"
5 PCIe x16 (Gen3) and one PCIe x8 (Gen3) for three double-deck cards
2U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s"
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
"
12 x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay with SES3
Optional 2 x 2.5"" hot-swap drive bay
"
4U Rackmount/Tower
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
"
4 x 3.5"" fixed drive bay
Optional 4 x 2.5"" fixed drive bay
"
2U Rackmount
"Single EPYC™ 7003/7002 Series Processor
(7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Supports CPU TDP up to 280W"
System on Chip (SoC)
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
2 front Hot-swap 2.5" U.2 NVMe Gen4 drive bays
"
6 PCI-E Gen 4 x16 (4 internal, 2 external) slots
1 PCI-E Gen 4 x16 AIOM networking slot
"
"2600W Redundant (1+1) Power Supplies
Titanium Level (96%)"
2U Rackmount
"Single AMD EPYC™ 7002/7003 Series Processor, Socket SP3, Supports CPU TDP up to 280W,Up to 64 Cores
"
System on Chip
"
16 DIMM slots
Up to 4TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM
"
"12 Hot-swap 3.5"" drive bays:
12 SATA3 by default
or 8 SATA3 + 4NVMe via optional cables
or 12 SAS3 via via optional SAS kit
Optional 2x 2.5"" peripheral drive support via additional rear drive bays kits
"
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
12x DIMM slots supporting up to 1,536GBMemory, Supports Intel Optane DC Persistent Memory Module (DCPMM)
24 x 2.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay
4U Rackmount
"Dual Socket P+ (LG-4189), 3rd Gen Intel® Xeon® Scalable processors
3 UPI up to 11.2GT/s, Support CPU TDP 270W
"
Intel® C621A
"16 DIMM Slots;
Up to 4TB DRAM;
Up to 4TB Intel® Optane™ Persistent Memory (up to 6TB with DRAM) ;
3200/2933/2666 ECC DDR4 LRDIMM;RDIMM;
Intel® Optane™ Persistent Memory 200 series"
8x 3.5" hot-swap NVMe/SATA/SAS Support drive bays 2 M.2 NVMe OR 2 M.2 SATA3
1U Rackmount
"Dual Socket P+ (LG-4189)
3rd Gen Intel® Xeon® Scalable processors, 3 UPI up to 11.2GT/s
Support CPU TDP 220W
"
"Intel® C621A
"
"16 DIMM Slots;
Up to 4TB DRAM;
Up to 4TB Intel® Optane™ Persistent Memory (up to 6TB with DRAM) ;
3200/2933/2666 ECC DDR4 LRDIMM;RDIMM;
Intel® Optane™ Persistent Memory 200 series"
4U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
Intel® C622
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
8x 3.5"/2.5" SAS/SATA Backplane for Hot-Swappable Drives
4U Rackmount
"2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 140W TDP, 2 UPI up to 10.4 GT/s"
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
"
36 x 3.5"" hot-swap SAS/SATA drive bay with SES3
Optional 2 x 2.5"" hot-swap drive bay
"
2U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s"
Intel® C621A
"Up to 4TB RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slotsP1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 series only."
"4U Tower Rackmount
"
"Dual Socket P+ (LGA-4189)
3rd Gen Intel® Xeon® Scalable processors, Support CPU TDP 270W ,Up to 40C/80T; Up to 60MB Cache
"
Intel® C621A Chipset
16 DIMM slots, UP to 4TB: 16x 256 GB DRAM, UP to 6TB: 8x 256 GB DRAM and 8x 512 GB PMem, Memory Type: 3200MHz ECC DDR4 RDIMM, LRDIMM, Intel® Optane™ persistent memory 200 series
"2U Rackmount
"
"2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s"
Intel® C621
"4U Rackmount
"
"2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s"
Intel® C621
2U Rackmount
"Single AMD EPYC™ 7003/7002 Series Processor
(7003 Series Processor drop-in support requires BIOS version 2.0 or newer) "
"
System on Chip
"
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
16 x 3.5" hot-swap SAS3/SATA drive bay, optional 2 x 2.5" hot-swap SAS3/SATA drive bay
7 low-profile expansion slot(s)
1600W Redundant Titanium AC Power Supply with PMbus 73.5x203x40mm
2U Rackmount
"Single AMD EPYC™ 7003/7002 Series Processor
(7003 Series Processor drop-in support requires BIOS version 2.0 or newer) "
"
System on Chip
"
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
12 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
7 low-profile expansion slot(s)
1200W/1000W Titanium Power Supply W/PMbus W76xL336xH40mm
4U Rackmount
"Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Support CPU TDP 270W
"
"
Intel® C621A
"
"
Memory Capacity: 16 DIMM slots
UP to 4TB: PMem and DRAM
Memory Type: 3200MHz ECC LRDIMM/RDIMM DDR4
Intel® Optane™ persistent memory 200 series
"
8x 3.5" hot-swap SATA3 drive bays (8x 3.5" hot-swap SATA drive bays can be converted to 8x SAS drive bays by adding 1x AOC-S3108L-H8IR or AOC-S3108L-H8IR-16DD + 2x CBL-SAST-0531-01)
"4 PCI-E 4.0 x16 Full Height (FH)
2 PCI-E 4.0 x8 Full Height (FH)"
1200W Redundant Power Supplies Titanium level 100-240Vac and 200-240 Vdc, Whisper-Quiet
4U Rackmount
"
Dual Socket P+ (LG-4189)
3rd Gen Intel® Xeon® Scalable processors
Support CPU TDP 120-270W
"
Intel® C621A
"
Memory Capacity: 16 DIMM slots
UP to 4TB: PMem and DRAM
Memory Type: 3200MHz ECC LRDIMM/RDIMM DDR4
Intel® Optane™ persistent memory 200 series
"
8x 3.5" hot-swap SATA3 drive bays (8x 3.5" hot-swap SATA drive bays can be converted to 8x SAS drive bays by adding 1x AOC-S3108L-H8IR or AOC-S3108L-H8IR-16DD + 2x CBL-SAST-0531-01)
"4 PCI-E 4.0 x16 Full Height (FH)
2 PCI-E 4.0 x8 Full Height (FH)"
1200W Redundant Power Supplies Titanium level 100-240Vac and 200-240 Vdc, Whisper-Quiet
Tower/5U Rackmount
3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
Intel® C621A
"Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 8 DIMM slots"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
Tower/5U Rackmount
3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
Intel® C621A
"Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 8 DIMM slots"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s"
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slotsP1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 Series only."
"
12 x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay with SES3
Optional 2 x 2.5"" hot-swap drive bay
"
2U Rackmount
"Dual Socket P+ (LGA 4189)
3rd Gen Intel® Xeon® Scalable processors
Support CPU TDP 185W ,Up to 32C/64T; Up to 48MB Cache"
Intel® C621A chipset
16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
24x 3.5" hot-swap SAS/SATA drive bays supporting SAS3/2 or SATA3 HDDs with 12Gbps throughput
"2 PCI-E 3.0 x8 (in x16),3 PCI-E 3.0 x8,1PCI-E 3.0 x4 (in x8),1 PCI-E 3.0 x4 (occupied by HBA card)
"
1200W/1000W Titanium Power Supply W/PMbus W76xL336xH40mm
2U Rackmount
"Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors
CPU TDP supports Up to 270W TDP
3 UPI up to 11.2 GT/s"
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz, Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
- Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slots (P1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane Persistent Memory 200 Series only)"
16x 2.5" hot-swap drive bays (8x SAS drive bays with Broadcom® 3908 HW RAID controller(backplane port# 0~7) and 8x SATA drive bays (backplane port# 8~15) with Intel® C621A (4x SATA drive bays (backplane port# 8~11) can be converted to NVMe drives with optional 2x CBL-SAST-0821-1)
Tower/5U Rackmount
"3rd Gen Intel® Xeon® Scalable processors, Intel® Xeon® W-3300 Processor
Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP"
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory, DDR4-3200MHz, in 16 DIMM slots"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
"4 PCI-E 4.0 x16,
3 PCI-E 4.0 x8 (in x16 slot)
M.2 Interface: 4 PCI-E 4.0 x4
M.2 Form Factor: 2260/2280/22110
M.2 Key: M-Key
M.2 support to RAID 0,1, 5, 10, VROC key is required for RAID."
550/1200W Redundant Power Supply Optional : 500/1200W Single Power Supply
Mid tower
"
3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
"
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 6TB Intel® Optane™ Persistent Memory, DDR4-3200MHz, in 16 DIMM slots;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode."
"4 x 3.5"" fixed drive bay Optional 4 x 2.5"" fixed drive bay
"
Tower/Convertible/5U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
Intel C622
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s"
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
"8 x 3.5"" hot-swap SAS3/SATA drive bay, 2 x 3.5"" fixed drive bay
"
2U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
Intel® C622
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
"12x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay with SES3
Optional rear 2x 2.5"" hot-swap drive bay kit"
"1 PCI-E 3.0 x16,1 PCI-E 3.0 x16 (x16 or x8 ),1 PCI-E 3.0 x8 (x0 or x8 ),1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8 slot)
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280, 22110
Key: M-Key
Double Height Connector
"
"
Memory Capacity: 32 DIMM slots
Up to 8TB: 32x 256 GB DRAM
Up to 12TB: 16x 512 GB PMem and 16x 256 GB DRAM
Memory Type: 3200/2933/2666MHz ECC DDR4 RDIMM;LRDIMM
Intel® Optane™ persistent memory 200 series
"
4U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s"
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
36 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
2U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
Intel® C622
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
"2x 3.5"" fixed drive bay
8x 3.5"" hot-swap SAS3/SATA drive bay
"
2U Rackmount
Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors
Intel® C621A
16 DIMM slots (16 DRAM + 4 PMem Up to 4TB: 16x 256 GB DRAM
Up to 6TB: 8x 256 GB DRAM and 8x 512 GB PMem
Memory Type: 3200MHz ECC DDR4 RDIMM
Intel® Optane™ persistent memory 200 series
2U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s"
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
12 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
1U Rackmount
Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP.
"
Intel® C621A
"
8 DIMM slots
Up to 2TB: 8x 256 GB DRAM
Up to 3TB: 4x 256 GB DRAM and 4x 512 GB PMem
Memory Type: 3200/2933/2666MHz ECC DDR4 RDIMM;LRDIMM
Intel® Optane™ persistent memory 200 series
10x hot-swap 2.5'' SATA3 drive bays with 4 hybrid NVMe/SATA drive bays, SAS3 with additional SAS controller card; Onboard 1x NVMe/SATA M.2
1U Rackmount
"Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors
Support CPU TDP 270W, CPUs with TDP higher than 185W may have support conditions due to power and thermal limitations.
"
Intel® C621A chipset
Memory Capacity: 16 DIMM slots, Up to 4TB: 16x 256 GB DRAM, Up to 6TB: 8x 256 GB DRAM and 8x 512 GB PMem
Memory Type: 3200/2933/2666MHz ECC DDR4 RDIMM;LRDIMM
Intel® Optane™ persistent memory 200 series
4U Rackmount
"
Single Socket P+ (LGA 4189)
Support Intel® 3rd Gen Xeon® Scalable Processors
Support CPU TDP 270W
"
Intel® C621A chipset
"Memory Capacity: 8 DIMM slots
Up to 2TB: 8x 256 GB DRAM
Up to 3TB: 4x 256 GB DRAM and 4x 512 GB PMem
Memory Type: 3200/2933/2666MHz ECC DDR4 RDIMM;LRDIMM"
2U Rackmount
Dual Socket P (LGA 3647)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
3 UPI up to 10.4GT/s
Support CPU TDP 70-205W*
Intel® C621 chipset
24 DIMM slots
Up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
6 Hot-swap 2.5" NVMe drive bays
2 PCI-E 3.0 (x16) Low-profile slots
1 SIOM card support
(must bundle with network card)
2600W Redundant Power Supplies
Titanium Level (96%)
1U Rackmount
"Single Socket H5 (LGA 1200)
Support Intel® Xeon® E-2300 series Processors and 10th Gen. Pentium® Processors
Support CPU TDP 95W"
Intel® C256
4 DIMMs; Up to 128GB of DDR4 ECC UDIMM memory with speeds of up to 3200MHz
2U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s"
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
24 x 2.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay
4U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s"
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
5U rack-mount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s"
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slotsP1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 Series only."
5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay
4U Rackmount
"Single AMD EPYC™ 7003/7002 Series Processor
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
Socket SP3"
System on Chip
Tower/5U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s"
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5