Virtualization,Cloud Computing,High End Enterprise Server
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2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
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Intel® C621 chipset
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Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
Up to 6TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only).
1000W High efficiency (96%),Redundant PSU; Titanium Level
Processor/Cache
Processor
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Chipset
Chipset
Intel® C621 chipset
System Memory
Memory Capacity
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
Up to 6TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only).
Expansion Slots
PCI-Express
2 PCI-E 3.0 x16 slots (FH, 10.5" L)
Integrated On-Board
SATA
SATA3 (6Gbps); RAID 0, 1, 5, 10
LAN
2 RJ45 10GBase-T ports,1 RJ45 Dedicated IPMI LAN port
Add-on Options
Raid Card
Optional
Optical Drive
None
Front Panel
LED Indicators
Power LED,Hard drive activity LED,Network activity LEDs,UID LED
Buttons
Power On/Off button,System Reset button
Drive bays
HDD Drives
10 Hot-swap 2.5" drive bays,10 NVMe (4 hybrid ports for optional SAS3 via AOC)
M.2
1 M.2 PCI-E 3.0 x4 M-Key NVMe and 1 M.2 M-Key SATA3 via optional riser card RSC-UMR-8, cable CBL-SAST-0538 and plastic stand-off FST-SCRW-0074L (2240/2260/2280/22110),2 M.2 PCI-E 3.0 x4 M-Key NVMe via optional add-on card AOC-SLG3-2M2 (2260/2280/22110)
Power Supply
Power Supply
1000W High efficiency (96%),Redundant PSU; Titanium Level
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
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