Compute Intensive Application, HPC, Data Center, Enterprise Server, Financial Analysis, Mission-critical applications
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Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
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2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
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Intel ®C621 chipset
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Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
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2 PCI-E 3.0 x16 slots
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Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN
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6 Hot-swap 2.5" SATA3 drive bays
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2200W Redundant Power Supplies Titanium Level (96%)
Processor/Cache
Processor
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Chipset
Chipset
Intel ®C621 chipset
System Memory
Memory Capacity
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Expansion Slots
PCI-Express
2 PCI-E 3.0 x16 slots
Integrated On-Board
SATA
SATA3 (6Gbps); RAID 0, 1, 5, 10 support
LAN
1 RJ45 Dedicated IPMI LAN port
Add-on Options
Raid Card
Optional
Optical Drive
None
Drive bays
HDD bays
6 Hot-swap 2.5" SATA3 drive bays
Front Panel
LED Indicators
Power status LED, HDD activity LED, Network activity LEDs, Universal Information (UID) LED
Buttons
Power On/Off button, UID button
Power Supply
Power Supply
2200W Redundant Power Supplies Titanium Level (96%)
Cooling System
Cooling System
4 Heavy duty 8cm PWM fans with optimal fan speed control
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
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