Corporate Database,Database Processing & Storage,Enterprise Server,HPC, Data Center.iSCSI SAN
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2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
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Intel® C622 chipset
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Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
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3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8,(slot 2 & 3 occupied by controller and JBOD expansion port)
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12 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays
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Broadcom 3108 SAS3 AOC
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2x 10GBase-T LAN ports with Intel X722 + PHY Intel X557
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Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN
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3 Hot-swap 8cm redundant PWM fans
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1200W Redundant Power Supplies Titanium Level (96%)
Processor/Cache
Processor
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Chipset
Chipset
Intel® C622 chipset
System Memory
Memory Capacity
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
Expansion Slots
PCI-Express
3 PCI-E 3.0 x16 slot,4 PCI-E 3.0 x8 slots,Slot 2 & 3 occupied by controller and JBOD expansion port
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
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