Compute Intensive Applications,HPC, Data Center, Enterprise Server,Hyperscale / Hyperconverged
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Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
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Dual AMD EPYC™ 7003/7002 Series Processors, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)Socket SP3, Support CPU TDP / cTDP up to 200W*, Up to 64 Cores
Note : Certain CPUs with high TDP may be supported only under specific conditions. Please contact TyroneTechnical Support for additional information about specialized system optimization
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System on Chip
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Up to 4TB ECC 3DS LRDIMM,up to DDR4-3200MHz; 16 DIMM slots
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2 PCI-E 4.0 x16 (LP) slot;1 IO Module support,(flexible networking)Note: must bundle with Network card
2200W Redundant Power Supplies Titanium Level (96%) 80 Plus Certified
Processor/Cache
Processor Note *
Dual AMD EPYC™ 7003/7002 Series Processors, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)Socket SP3, Support CPU TDP / cTDP up to 200W*, Up to 64 Cores
Note : Certain CPUs with high TDP may be supported only under specific conditions. Please contact TyroneTechnical Support for additional information about specialized system optimization
Chipset
Chipset
System on Chip
System Memory
Memory Capacity
16 DIMM slots,Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs,8-channel memory bus
For Dual CPUs: Recommended that memory be populated equally in adjacent memory banks,Memory Type DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs,
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
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