Compute Intensive Application,HPC, Data Center, Enterprise,Server,Hyperscale / HyperconvergedFour hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
•
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
•
Intel® C621 chipset
•
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
•
2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking),Note: must bundle with Network card
•
IPMI 2.0 + KVM with dedicated LAN
•
6 Hot-swap 2.5" NVMe drive bays;2 M.2 SATA3 or NVMe support
•
Video via Aspeed AST2500 BMC
•
4 Heavy duty 8cm PWM fans with air shroud
•
2200W Redundant Power Supplies,Titanium Level (96%)
Processor/Cache
Processor
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Chipset
Chipset
Intel® C621 chipset
System Memory
Memory Capacity
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
Products 
