2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
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Intel® C621 Chipset
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Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
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2 PCI-E 3.0 x8 (in x16 slot),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8 slot) ,M.2 Interface: PCI-E 3.0 x4 and SATA,Form Factor: 2280, 22110Key: M-Key,Double Height Connector
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2 GbE LAN ports
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8 SATA3 (6Gbps) ports
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I/O: 1 VGA, 2 COM, TPM header
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2 SuperDOM with built-in power
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5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
4 x 40x28mm PWM fan(s),Optional 2 x fans for AOC cooling
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600W Redundant Single Output Power Supply w/PMBus, short depth, W54.5xL220xH40
Processor/Cache
Processor
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Chipset
Chipset
Intel® C621 Chipset
System Memory
Memory Capacity
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
Expansion Slots
PCI-Express
2 PCI-E 3.0 x8 (in x16 slot),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8 slot) ,M.2 Interface: PCI-E 3.0 x4 and SATA,Form Factor: 2280, 22110Key: M-Key,Double Height Connector
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
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