2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
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Intel® C621
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Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only)
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1 PCI-E 3.0 x32 Left Riser Slot,1 PCI-E 3.0 x16 Right Riser Slot,1 PCI-E 3.0 x16 for Add-On-Module (AOM),M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2242, 2260, 2280, 22110,M.2 Key: M-Key
4 x 40x56mm counter-rotation PWM fan(s)Optional 2 x fans for AOC cooling
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700W/750W Platinum Power Supply W/PMbus W437xL597xH43mm
Processor/Cache
Processor
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Chipset
Chipset
Intel® C621
System Memory
Memory Capacity
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only)
Expansion Slots
PCI-Express
1 PCI-E 3.0 x32 Left Riser Slot,1 PCI-E 3.0 x16 Right Riser Slot,1 PCI-E 3.0 x16 for Add-On-Module (AOM),M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2242, 2260, 2280, 22110,M.2 Key: M-Key
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
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