2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
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Intel® C622
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Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
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M.2 NGFF connector, M.2 Interface: PCI-E 3.0 x4 and SATA, Form Factor: 2280, 22110, Key: M-Key, Double Height Connector
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External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
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Front: 120 x 25 mm x1 PWM Fan,Rear: 120 x 25 mm x1 PWM Fan
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550/1200W Redundant Power Supply, 80Plus Platinum Optional :500/1200W Single Power Supply, 80Plus Platinum
Processor/Cache
Processor
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
Chipset
Chipset
Intel® C622
System Memory
Memory Capacity
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
2 Network Activity LEDs, HDD Fail LED, Power Status LED, Power Fail LED, System Information LED
Buttons
Power On/Off button, System Reset Button
Drive bays
HDD Bays
HDD bays: External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
Power Supply
Power Supply
550/1200W Redundant Power Supply, 80Plus Platinum Optional :500/1200W Single Power Supply, 80Plus Platinum
Cooling System
Cooling System
Front: 120 x 25 mm x1 PWM Fan,Rear: 120 x 25 mm x1 PWM Fan
Form Factor
Form Factor
Tower/Convertable/5U Rackmount
"Dimensions: 560 x 200 x 430 mm (22"" x 7.9"" x 16.9"")
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Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
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