2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 2 UPI up to 10.4 GT/s
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Intel® C621 chipset
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Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
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4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots 1 PCH slot for Thunderbolt 3.0 AOC support
900/1200W High-efficiency Power Supply Platinum Level Certified
Processor/Cache
Processor
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 2 UPI up to 10.4 GT/s
Chipset
Chipset
Intel® C621 chipset
System Memory
Memory Capacity
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
Expansion Slots
PCI-Express
4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots 1 PCH slot for Thunderbolt 3.0 AOC support
Integrated On-Board
SATA
SATA3 (6Gbps); RAID 0, 1, 5, 10
LAN
2 RJ45 Gigabit Ethernet LAN ports
Add-on Options
Raid
Optional
Optical Drive
Optional
Drive bays
HDD bays
4 Fixed 3.5" drive bays,4x 2.5" fixed drive bays (optional) ,4 x Hot swap drive bays (optional)
Peripheral Bays
2x 5.25" standard drive bays, 2 x 5.25" Standard drive bays (optional)
Front Panel
LED Indicators
Power LED, Hard drive activity LED, Network activity LED, System Overheat LED
Buttons
Power On/Off button
Power Supply
Power Supply
900/1200W High-efficiency Power Supply Platinum Level Certified
Cooling System
Cooling System
1x 12cm rear exhaust fan,1x 12cm front cooling fan, Optimized cooling technology for Whisper-Quiet Operation
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
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