2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
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Intel ®C621 chipset
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Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
4 Heavy duty fans, 4 exhaust fans, and 2 active heatsink with optimal fan speed control
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2200W Redundant Power Supplies Titanium Level (96%)
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GPU Kit for passive GPU/Coprocessor support (MCP-320-74701-0N-KIT)
Processor/Cache
Processor
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Chipset
Chipset
Intel ®C621 chipset
System Memory
Memory Capacity
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
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