2U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s"
Intel ®C621 chipset
"Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);"
8 Hot-swap 3.5" SATA drive bays
4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots
600W platinum efficiency multiple output power supply
Octa Socket P (LGA 3647)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors.
8S-3 UPI up to 10.4GT/s
Support CPU TDP 70-205W
Up to 28 Cores
Intel ®C621 chipset
2U Rackmount
Dual Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors Intel Xeon CPU Max Series with high bandwidth memory (HBM) Note Supports up to 350W TDP CPUs (Aircooled) Supports up to 350W TDP CPUs (Liquid Cooled)
Chipset Intel C741
"Memory Capacity: 32 DIMM slots
Up to 8TB: 32x 256 GB DRAM
Memory Type: 4800MHz ECC DDR5"
12x 3.5" hot-swap NVMe/SATA/SAS drive bay, 2 M.2 NVMe OR 2 M.2 SATA3
2U Rackmount
Dual Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors Note Supports up to 300W TDP CPUs (Aircooled) CPUs with high TDP (air cooled) only supported under specific conditions.
Chipset Intel C741
"Memory Capacity: 16 DIMM slots Up to 4TB: 16x 256 GB DRAM Memory Type: 4800MHz ECC DDR5 RDIMM"
"8x 3.5"" hot-swap drive bay8x 3.5"" hot-swap SATA drive bays can be converted to 8x SAS drive bays by adding 1x AOC-S3908L-H8IR-16DD-0)
M.2 - 2 M.2 NVMe
Peripheral Bays - 1x slim DVD drive bays (optional)"
2U Rackmount
"Quad Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors 3 UPI up to 16GT/s. Note : Supports 165W - 350W TDP CPUs (Aircooled)
CPUs with high TDP (air cooled) only supported under specific conditions. Contact Technical Support for details"
Intel C741
Memory Capacity: 64 DIMM slots, Up to 16TB: 64x 256 GB DRAM, Up to 24TB: 32x 256 GB DRAM and 32x 512 GB PMem, Memory Type: 4800MHz ECC DDR5 RDIMM/RDIMM-3DS, Intel® Optane™ persistent memory 300 series
4U/Full Tower
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Single Socket H4 (LGA 1151),CPU TDP support up to 95W
Support Intel® Xeon® processor E-2100 / E-2200 series, 8th/9th Gen. Intel® Core™ i9/i7/i5/i3 Processors, Intel® Celeron®, Intel® Pentium®
Up to 8-Cores
Intel® C246 chipset
4 DIMM slots
4 Fixed 3.5", Opt. 4 2.5" drive bays, 2 Standard 5.25" drive bays,1 Fixed 3.5" device bay
2 PCI-E 3.0 x16 running at NA/16 or 8/8,1 PCI-E 3.0 x4 slot,1 PCI-E 3.0 x1 slot
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 512GB Registered ECC RDIMM
12 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
5U
Intel® Xeon® W-3400 series and Xeon® W-2400 series processors
Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP,
Up to 56 cores
Intel W790
Memory Capacity: 8 DIMM slots
Up to 2TB 3DS ECC Registered RDIMM, DDR5-4800MHz
Drive Bays: External 5.25" x 4, 3.5" x 1, Internal 2.5"/3.5" x 5
Tower/Convertible/Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
3U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 512GB Registered ECC RDIMM
16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
8 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays/Hot swap bays
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
8 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays/Hot swap bays
"4 PCIe 4.0 x8 FHHL slot(s)
2 PCIe 4.0 x16 FHHL slot(s)
(Slots 1 and 4 can convert to x16 by merging 2 and 3. Slots 1, 2, 4 and 5 can support FHFL cards with 1U heatsinks. Some slots share PCIe lanes with NVME. FH = Full Height, LP = Low Profile, FL = Full Length, HL = Half Length, DW = Double Width, SW = Single Width)"
Tower/Convertible/Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
4 PCI-E 3.0 x16,2 PCI-E 3.0 x8
500W/1200W Single power supply 80 Plus Platinum Certified
3U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer), Up to 64 CoresSystem on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay
3U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)System on Chip
4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs
8x 3.5" hot-swap SAS/SATA drive bay Peripheral Drives: 1x slim DVD-ROM drive bay
Tower/Convertible/5U Rackmount
Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required),Socket SP3 Up to 240W TDP Up to 32 Cores
System on Chip
2TB Registered ECC DDR4 ,2666MHz SDRAM in 16 DIMMs
External: 5.25" x 4, 3.5" x 1 ,Internal: 3.5" or 2.5" x 5
5U Rackmount/Tower
AMD Ryzen™ 7000 series Processors
Single Socket LGA-1718 (Socket AM5) supported, CPU TDP supports Up to 170W TDP
Core
Up to 16 cores, 32 threads
System on Chip
4 DIMM slots MemoryType:5200/4800/3600 MT/s Up to 128GB of memory with speeds of up to 5200MT/s (2DPC)/ 3600MT/s (1DPC) ,DIMM Sizes
16GB, 32GB, 64GB, 128GB
External 5.25" x 4, 3.5" x 1, Internal 2.5"/3.5" x 5
5U rack-mount
Intel® 8th/9th Generation Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® series Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 95W TDP
Intel® Q370
Up to 64GB Unbuffered non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots
5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
5U rack-mount
Intel® 8th/9th Generation Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® series Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 120W TDP
Intel® Z390 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2 PCI-E 3.0 x16 slots (16/NA or 8/8),
1 PCI-E 3.0 x4,3 PCI-E 3.0 x1
CPU Slot3 PCI-E 3.0 x8 (IN x16) slot and CPU Slot1 PCI-E 3.0 x4 slot share the same PCI-Ex16 link with CPU Slot6 PCI-E 3.0 x16 slot. CPU Slot6 PCI-E 3.0 x16 slot and CPU Slot3 PCI-E 3.0 x8 (IN x16) slot will change to PCI-E 3.0 x8 link and PCI-E 3.0 x4 link respectively when an add-on card is installed in CPU Slot1 PCI-E 3.0 x4 slot,M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1,M.2 Form Factor: 2242/2260/2280/22110, 2242/2260/2280
M.2 Key: M-Key, M-Key
Mid-tower
Intel® Xeon® Processor Skylake-W , Intel® Xeon® Processor W Family., Single Socket R4 (LGA 2066) supported, CPU TDP support Up to 140W
Intel® C422
Up to 256GB Registered ECC RDIMM, DDR4-2666MHz; Up to 512GB Registered ECC LRDIMM, in 8 DIMM slots
6 x 3.5" fixed drive bay,4 x 2.5" fixed drive bay
3 PCI-E 3.0 x16,1 PCI-E 3.0 x4,3xPCI-E3.0 x16 Slots(8/16/16,1xPCI-E3.0x4
M.2 Interface: 2 PCI-E 3.0 x4,M.2 Form Factor: 22110,M.2 Key: M-Key (RAID 0,1 support),M-Key for SSD and Optane(up to Intel POR). Intel VROC licence kit is needed to enable RAID.,U.2 Interface: 2 PCI-E 3.0 x4
Tower/Convertible/5U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C622
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
Tower/Convertible/5U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C622
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C622 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots(2933MHz in two DIMMs per channel supported on Rev 1.10 MB only) ;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
Tower/Convertible/5U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
Intel® C621 Chipset
"Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2 PCI-E 3.0 x8 (in x16 slot),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8 slot)
M.2 :M.2 Interface: PCI-E 3.0 x4 and SATA,Form Factor: 2280, 22110,Key: M-Key,Double Height Connector
Tower/Convertible/5U Rackmount
8th Generation Intel® Core™ i7(8086K and 8700K are not supported) /i5/i3/Pentium®/Celeron® Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 120W TDP
Intel® Z370 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
Tower/Convertible/5U Rackmount
8th Generation Intel® Core™ i7(8086K and 8700K are not supported)/i5/i3/Pentium®/Celeron® Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 120W TDP
Intel® Z370 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
12 x 3.5" hot-swap SAS/SATA drive bay with SES3
Expansion slots:2 PCI-E 3.0 x8 (in x16),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8)
920W Redundant Platinum Super Quiet power supply W/PMbus
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Quad Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 12TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 12TB 3DS ECC LRDIMM, DDR4-2933MHz, in 48 DIMM slotsUp to 12TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM in 48 DIMM slots; Up to 12TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
24 Hot-swap 3.5" SAS3/SATA3 drive bays Optional 24 SAS3 ports via AOC Optional 16 SAS3 ports via AOC + 8 NVMe ports via AOC
1 PCI-E 3.0 x32 Left Riser. 1 PCI-E 3.0 x40 Ultra Riser. 1 PCI-E 3.0 x8 in x16 slot rear Middle Riser. 1 PCI-E 3.0 x32 for 2U (or x48+x8 for 4U) on front for NVMe card support. 1 PCI-E 3.0 (x32 for 2U or x48 for 4U) on front for NVMe card support.
1600W (3+1) Redundant Power Supplies Platinum Level (96%)
3U Rack-mount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
24 x 2.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay
4U Rackmount
Intel® Xeon® Processor Skylake-W , Intel® Xeon® Processor W Family.
Single Socket LGA-2066 (Socket R4) supported, CPU TDP support Up to 140W TDP
Intel® C422
Up to 256GB Registered ECC RDIMM, DDR4-2666MHz; Up to 512GB Registered ECC LRDIMM, DDR4-2666MHz, in 8 DIMM slots
8 x 3.5" hot-swap SAS/SATA drive bay with SGPIO
3 PCI-E 3.0 x16,1 PCI-E 3.0 x4,3xPCI-E3.0 x16 Slots(8/16/16 (Skylake-W 48 lanes), 1xPCI-E3.0x4 slots,M.2 Interface: 2 PCI-E 3.0 x4,Form Factor: 22110,Key: M-Key (RAID 0,1 support),M-Key for SSD and Optane(up to Intel POR). Intel VROC licence kit is needed to enable RAID.
Mid-tower Rackmount
Intel® 8th/9th Generation Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® series Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 95W TDP
Intel® Q370
Up to 64GB Unbuffered non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots
4 x 3.5" fixed drive bay, Optional 4 x 2.5" fixed drive bay
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only)
10 x 2.5" hot-swap SAS/SATA drive bay
1 PCI-E 3.0 x32 Left Riser Slot,
1 PCI-E 3.0 x16 Right Riser Slot,
1 PCI-E 3.0 x16 for Add-On-Module (AOM)
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2242, 2260, 2280, 22110
M.2 Key: M-Key
700W/750W Platinum Power Supply W/PMbus W437xL597xH43mm
4U Rackmount
8th Generation Intel® Core i7(8086K and 8700K are not supported) /i5/i3/Pentium®/Celeron® Processor.Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 120W TDP
Intel® Z370 Express
Up to 64GB Unbuffered non-ECC UDIMM, DDR4-up to 3000+ MHz (OC), in 4 DIMM slots
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz Or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots; Xeon-W 32xx supports up to 2TB 3DS ECC RDIMM/LRDIMM, Xeon-W 32xx supports up to 1TB 3DS RDIMM/LRDIMM. ;Xeon-W32xx series processors don't support DCPMM.
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
4 PCI-E 3.0 x16,
3 PCI-E 3.0 x8 (in x16 slot),
PCI-Ex16 Slot#1 shares with M.2, Slot#2 shares with Slot#3(NA/16,8/8), Slot#4 shares with Slot#5(NA/16,8/8), Slot#6 shares with Slot#7(NA/16,8/8)
(16/NA/16/NA/16/NA/16 or 16/8/8/8/8/8/8)
M.2 Interface: 4 PCI-E 3.0 x4, RAID 0 & 1
M.2 Form Factor: 2242/2260/2280/22110
M.2 Key: M-Key
M.2 shares PCI-E lanes with PCI-Ex16 slot#1, VROC key is required for Raid.
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz Or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots; Xeon-W 32xx supports up to 2TB 3DS ECC RDIMM/LRDIMM, Xeon-W 32xx supports up to 1TB 3DS RDIMM/LRDIMM. ;Xeon-W32xx series processors don't support DCPMM.
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
4 PCI-E 3.0 x16,
3 PCI-E 3.0 x8 (in x16 slot),
PCI-Ex16 Slot#1 shares with M.2, Slot#2 shares with Slot#3(NA/16,8/8), Slot#4 shares with Slot#5(NA/16,8/8), Slot#6 shares with Slot#7(NA/16,8/8)
(16/NA/16/NA/16/NA/16 or 16/8/8/8/8/8/8)
M.2 Interface: 4 PCI-E 3.0 x4, RAID 0 & 1
M.2 Form Factor: 2242/2260/2280/22110
M.2 Key: M-Key
M.2 shares PCI-E lanes with PCI-Ex16 slot#1, VROC key is required for Raid.
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
4U Rackmount
Intel® Xeon® Scalable Processors, Intel® Xeon® W-32xx Processor.
Single Socket LGA-3647 (Socket P) supported, CPU TDP support 205W TDP
Intel® C621
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz Or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots;Xeon-W 32xx supports up to 2TB 3DS ECC RDIMM/LRDIMM, Xeon-W 32xx supports up to 1TB 3DS RDIMM/LRDIMM. ;Xeon-W32xx series processors don't support DCPMM.
5 x 3.5" hot-swap SAS3/SATA drive bay
4 PCI-E 3.0 x16,
3 PCI-E 3.0 x8 (in x16 slot),
PCI-Ex16 Slot#1 shares with M.2, Slot#2 shares with Slot#3(NA/16,8/8), Slot#4 shares with Slot#5(NA/16,8/8), Slot#6 shares with Slot#7(NA/16,8/8)
(16/NA/16/NA/16/NA/16 or 16/8/8/8/8/8/8),M.2 Interface: 4 PCI-E 3.0 x4, RAID 0 & 1
M.2 Form Factor,2242/2260/2280/22110
M.2 Key: M-Key,M.2 shares PCI-E lanes with PCI-Ex16 slot#1, VROC key is required for Raid.
800W Redundant Power Supplies Platinum Level (94%)
2U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)Socket SP3, Support CPU TDP / cTDP up to 200W*, Up to 64 Cores
Note : Certain CPUs with high TDP may be supported only under specific conditions. Please contact TyroneTechnical Support for additional information about specialized system optimization
System on Chip
Up to 4TB ECC 3DS LRDIMM,up to DDR4-3200MHz; 16 DIMM slots
2U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor
(7003 Series Processor drop-in support requires BIOS version 2.0 or newer)Socket SP3, Supports CPU TDP / cTDP up to 280W, Up to 64 Cores
Note : Certain CPUs with high TDP may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
System on Chip
Up to 2TB ECC 3DS LRDIMM,up to DDR4-3200MHz; 8 DIMM slots
3 Hot-swap 3.5" SATA3 drive bays
2 PCI-E 4.0 (x16) Low-profile slots,1 SIOM card support
(must bundle with network card)
M.2 Interface: 1 SATA/PCI-E 3.0 x4, Form Factor: 2280, 22110
Key: M-key
2000W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
"AMD EPYC™ 9004 series Processors
Single Socket SP5 supported, CPU TDP supports Up to 400W TDP, Up to 128 cores, 256 threads"
System on Chip
"12 DIMM slots Up to 3TB 3DS ECC Registered RDIMM, DDR5-4800MHz"
"8x 3.5""(tool-less) or 2.5""(screw) hot-swap SAS3/SATA drive bay
Optional 2x 3.5"" fixed drive bay, Optional rear 2x 2.5"" hot-swap drive bay kit"
2U Rackmount
"AMD EPYC™ 9004 series Processors
Single Socket SP5 supported, CPU TDP supports Up to 400W TDP, Up to 128 cores, 256 threads"
System on Chip
"12 DIMM slots Up to 3TB 3DS ECC Registered RDIMM, DDR5-4800MHz""
"24 x 2.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay"
1U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Support CPU TDP up to 280W, Up to 64 Cores
System on Chip
8 DIMMs; up to 2TB 3DS ECC,DDR4-3200MHz RDIMM/LRDIMM
1U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer),Socket SP3 Support CPU TDP up to 280W, Up to 64 Cores
System on Chip
8 DIMMs; up to 2TB 3DS ECC, DDR4-3200MHz RDIMM/LRDIMM
10 Hot-swap 2.5" SATA3 drive bays
Optional 2 U.2 NVMe (PCI-E 3.0) drive support via additional kit for NVMe devices
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only);
8 x 3.5" hot-swap SAS3/SATA drive bay
2 x 3.5" fixed drive bay
1U Rackmountable
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
8 x 2.5" hot-swap SAS/SATA drive bay
2 PCI-E 3.0 x8 (in x16 slot),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8 slot)
M.2 :M.2 Interface: PCI-E 3.0 x4 and SATA,Form Factor: 2280, 22110,Key: M-Key,Double Height Connector
1U 600W Redundant Single Output Power Supply w/PMBus, short depth, W54.5xL220xH40
5U Rackmount/Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only);
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
5U Rackmount/Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only);
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s"
Intel® C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
4 Hot-swap 2.5" SAS3/SATA3 drive bays
2 PCI-E 3.0 x16 Low-profile slots, 1 SIOM card support
1000W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required),Socket SP3, Up to 32 Cores, Up to 64 Cores (Board revision 2.x required)
"
System on Chip (SoC)
1U Rackmount
"Intel® Xeon® processor D-2146NT, CPU TDP support 80W, 8 Cores, 16 Threads
"
System on Chip (SoC)
Up to 512GB DDR4 ECC LRDIMM, Up to 256GB DDR4 ECC RDIMM 4 DIMM slots
Memory Type :2666/2400/2133MHz ECC DDR4 L/RDIMM
Operating speed up to 2133MHz
2x 2.5"" drive bays (one drive space shares with M.2)
4 PCI-E 3.0 x8 slots for AIOM (AIOM is sold separately, it is not included in this standard/barebone system)
M.2
2 M.2 M-Key 2280/22110 (space share with one 2.5"" drive bay)
1 M.2 E-Key 2230
1 M.2 B-Key 3042
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
8 x 3.5"" hot-swap SAS3/SATA drive bay, 2 x 3.5"" fixed drive bay
5U Rackmount/Tower
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
5U Rackmount/Tower
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
Tower/Convertable/ 5U Rackmount
Intel® Xeon® W-2100 Processors., Single Socket LGA-2066 (Socket R4) supported, CPU TDP support Up to 140W TDP
Intel® C422
Up to 256GB ECC RDIMM, DDR4-2666MHz; Up to 512GB ECC LRDIMM, DDR4-2666MHz, in 8 DIMM slots
Drive bays:External:5.25" x 4, 3.5" x 1,Internal: 3.5" or 2.5" x 5
Tower/Convertable/ 5U Rackmount
Intel® Xeon® W-2100 Processors., Single Socket LGA-2066 (Socket R4) supported, CPU TDP support Up to 140W TDP
Intel® C422
Up to 256GB ECC RDIMM, DDR4-2666MHz; Up to 512GB ECC LRDIMM, DDR4-2666MHz, in 8 DIMM slots
Drive bays:External:5.25" x 4, 3.5" x 1,Internal: 3.5" or 2.5" x 5
2U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s"
Intel® C621 chipset
"Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);"
4 Hot-swap 2.5"" NVMe/SATA3 + 2 Hot-swap 2.5"" SATA3 drive bays
M.:21 M.2 NVMe or SATA (2280/22110)
2U Rackmount
Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
16 x 2.5" hot-swap SAS3/SATA drive bay, 1 x 5.25" drive bay
4U Rackmount/Tower
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
10U Rackmount
"Dual Socket P (LGA 3647)Intel® Xeon® Scalable Processors,
3 UPI up to 10.4GT/s, Support CPU TDP 205W, Cores Up to 28 Cores, GPU Supports 16 V100 SXM3 350W
"
Intel® C621 chipset
24 DIMM slots, Up to 3TB 3DS ECC L/RDIMM, up to DDR4-2666MHz
Memory Type 2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
16 Hot-swap 2.5"" NVMe drive bays *
6 Hot-swap 2.5"" SATA3 drive bays
M.2
M.2 Interface: 2 PCI-E 3.0 x4
Form Factors: 2280, 22110
Key: M-Key
Note * NVMe hot-swap feature doesn't work in Windows environment
16 PCI-E 3.0 x16 for RDMA via IB EDR
2 PCI-E 3.0 x16 on motherboard
6x (5+1) 3000W Redundant Power
Supplies; Titanium Level (96%+)
4U Rackmount
Single Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡
Intel® Xeon® W-32xx Processors
Support CPU TDP up to 205W
Up to 28 Cores BIOS version 3.0b or above is required to support 2nd Gen. Intel® Xeon® Scalable processors
Intel® C621
12 DIMM slots
Intel® Xeon® Scalable Processors: Support up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots.
Intel® Xeon® W-3200 Processors: Support up to 2TB 3DS ECC RDIMM/LRDIMM; up to 1TB 3DS RDIMM/LRDIMM. (Xeon® W-3200 doesn't support DCPMM.)
Mid Tower
"Single Socket H4 (LGA 1151),CPU TDP support up to 95W Support Intel® Xeon® processor E-2100 / E-2200 series,
8th Gen. Intel® Core™ i3 Processors,
Intel® Celeron®, Intel® Pentium®
"
Intel® C242 chipset
4 DIMM slots Up to 128GB ECC UDIMM
Up to DDR4-2666MHz Memory Type
2666/2400/2133MHz ECC DDR4 SDRAM
DIMM Sizes 32GB, 16GB, 8GB
Note: Future support for 128GB via BIOS update expected in early 2019
Tower/5U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
"
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 6TB Intel® Optane™ Persistent Memory, DDR4-3200MHz, in 16 DIMM slots;
Up to 6TB Intel® Optane DC Persistent Memory in memory mode."
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
Tower/Convertible/5U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
"Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Note : BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP
"
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
16 x 3.5"" hot-swap SAS3/SATA drive bay
Optional 2 x 2.5"" hot-swap SAS3/SATA drive bay
4U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required), Socket SP3
Cores Up to 32 Cores Up to 64 Cores (Board revision 2.x required)
"
System on Chip
4U Rackmount
"
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
"
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
1U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Up to 28 Cores Note : BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors"
" Intel® C621 chipset
"
24 DIMM slots
Up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only);
36 x 3.5"" hot-swap SAS/SATA drive bay with SES3
Optional 2 x 2.5"" hot-swap drive bay
3U Rackmount
"Dual Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡,
3 UPI up to 10.4GT/s, Support CPU TDP 205W
"
Intel® C621
16 DIMM slots, Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
1U Rackmount
"Single AMD EPYC™ 7001/7002* series Processor (*Board revision 2.x required) Socket SP3
Supports CPU TDP 225W / cTDP up to 240W*
"
System on Chip (SoC)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
"Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
4 hot-swap 3.5" SATA3 drive bays
"2 PCI-E 3.0 x8 (in x16),
4 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)"
400W Redundant Power Supply Platinum with PMBUS, W54.5xL220xH40mm
Tower/Convertible/5U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
"Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
5U rack-mount
Intel® 8th/9th Generation Core i9/Core i7/Corei5/Corei3/Pentium®/Celeron® series Processor., Single Socket LGA 1151 supported, CPU TDP support Up to 140W
Intel® Z390 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
"4 PCI-E 3.0 x16 slots (16/NA/16/NA or 16/NA/8/8 or 8/8/16/NA or 8/8/8/8),1 PCI-E 3.0 x1, M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1 and 1 CNVi
M.2 Form Factor: 2260/2280/22110, 2260/2280, 2230, M.2 Key: M-Key, M-Key, E-Key (RAID 0,1 support)
M.2-M1 port shares PCI-E link with U2-1 port;M.2-M2 port shares link with SATA port4 and port5; M.2-E1 port pre-installed one 802.1ac WiFi+BT5.0 module
U.2 Interface: 2 PCI-E 3.0 x4 and PCI-E 3.0 x4"
5U rack-mount
Intel® 8th/9th Generation Core i9/Core i7/Corei5/Corei3/Pentium®/Celeron® series Processor., Single Socket LGA 1151 supported, CPU TDP support Up to 140W
Intel® Z390 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
"4 PCI-E 3.0 x16 slots (16/NA/16/NA or 16/NA/8/8 or 8/8/16/NA or 8/8/8/8),1 PCI-E 3.0 x1, M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1 and 1 CNVi
M.2 Form Factor: 2260/2280/22110, 2260/2280, 2230, M.2 Key: M-Key, M-Key, E-Key (RAID 0,1 support)
M.2-M1 port shares PCI-E link with U2-1 port;M.2-M2 port shares link with SATA port4 and port5; M.2-E1 port pre-installed one 802.1ac WiFi+BT5.0 module
U.2 Interface: 2 PCI-E 3.0 x4 and PCI-E 3.0 x4"
550/1200W Redundant power supply , 80Plus Platinum
4U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors,(7003 Series Processor drop-in support requires BIOS version 2.0 or newer)*
Socket SP3, Supports CPU TDP up to 280W, Up to 128 Cores (64 per CPU)
Note :Supports 2 CPUs only – single socket not supported, Certain CPUs with high TDP may be supported only under specific conditions. Please contact TyroneTechnical Support for additional information about specialized system optimization, 4U Dual Processor (AMD), Dual-Root GPU system with 8 PCI-E GPUs.
System on Chip
2U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer),Socket SP3, Supports CPU TDP up to 280W, Up to 128 Cores (64 per CPU)
Note :Certain CPUs with high TDP may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
GPU Supports HGX A100 4-GPU 40GB (HBM2) or 80GB(HBM2e) with NVLink GPU interconnect and PCI-E Gen4 host CPUs
System on Chip
"32 DIMM slots
Up to 8TB 3DS ECC DDR4-3200MH SDRAM
Memory Type
3200MHz ECC DDR4 SDRAM"
1U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
Intel ®C621 chipset
"Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
"
2 x 3.5"" fixed drive bay
SAS or enterprise SATA HDD only recommended
"
2U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors,(7003 Series Processor drop-in support requires BIOS version 2.0 or newer)Socket SP3, Supports CPU TDP up to 280W, Up to 64 Cores
Note : Certain CPUs with high TDP higher than 225W may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
System on Chip
8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
"12 hot-swap 3.5"" Drive Bays:
12 SATA3 by default
or 8 SATA3 + 4 NVMe via optional tray
or 12 SAS3 via optional SAS kit
"
1U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
Intel® C622 chipset
"Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
2U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
Intel® C622 chipset
"Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
8 x 3.5" hot-swap SAS3/SATA drive bay, 2 x 3.5" fixed drive bay
3U rack-mount
Intel® 8th/9th Generation Core i9/Core i7/Corei5/Corei3/Pentium®/Celeron® series Processor., Single Socket LGA 1151 supported, CPU TDP support Up to 140W
Intel® Z390 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
"4 x 3.5"" fixed drive bay
Optional 4 x 2.5"" fixed drive bay"
"4 PCI-E 3.0 x16 slots (16/NA/16/NA or 16/NA/8/8 or 8/8/16/NA or 8/8/8/8),1 PCI-E 3.0 x1, M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1 and 1 CNVi
M.2 Form Factor: 2260/2280/22110, 2260/2280, 2230, M.2 Key: M-Key, M-Key, E-Key (RAID 0,1 support)
M.2-M1 port shares PCI-E link with U2-1 port;M.2-M2 port shares link with SATA port4 and port5; M.2-E1 port pre-installed one 802.1ac WiFi+BT5.0 module
U.2 Interface: 2 PCI-E 3.0 x4 and PCI-E 3.0 x4"
2U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
Socket SP3, Up to 240W TDP
Up to 32 Cores
Up to 64 Cores (Board revision 2.x required)"
System on Chip
2U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
Socket SP3, Up to 240W TDP
Up to 32 Cores
Up to 64 Cores (Board revision 2.x required)"
System on Chip
2U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
Socket SP3, Up to 240W TDP
Up to 32 Cores
Up to 64 Cores (Board revision 2.x required)"
System on Chip
