2U Rackmount
Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores Note : Supports up to 330W TDP CPUs (Air Cooled)* Supports up to 330W TDP CPUs (Liquid Cooled)
System on Chip
32 DIMM slots supporting up to 4TB of memory
8 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays Option A: Total 12 bays 12 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays
4U rackmount
Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)
Intel® C741
4U Rackmount
Dual Socket SP5 4th Generation AMD EPYC™ 9004 Series Processor Support CPU TDP up to 360W *
System On Chip
Memory Capacity: 24 DIMM slots Up to 6TB: 3DS ECC Registered RDIMM, DDR5-4800MHz Memory Type: 4800MHz ECC DDR5 RDIMM Up to 512GB of memory
60 x 2.5"/3.5" Top loading Bays (SAS/SATA) with 2 x 30 drive expander backplane 12 x 2.5"/3.5" Rear Bays (SAS/SATA/NVMe) with direct attached backplane
4U Rackmount
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors and Intel® Xeon® Max Series processors, Dual Socket Socket E (LGA-4677) supported, CPU TDP supports Up to 350W TDP SP XCC, SP MCC, and MAX Series (HBM) SKUs are supported
Intel C741® Chipset
32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-4800
60 x 2.5"/3.5" Top loading Bays (SAS/SATA) with 2 x 30 drive expander backplane 12 x 2.5"/3.5" Rear Bays (SAS/SATA/NVMe) with direct attached backplane
1U Rackmount
AMD EPYC™ 4004 series Processors Single Socket LGA-1718 (Socket AM5) supported, CPU TDP supports Up to 170W TDP, Up to 16 cores, 32 threads
Chipset B650
Up to 192GB ECC/non-ECC Unbuffered DIMM, DDR5-5200MHz, in 4 DIMM slots.
2x 2.5" fixed drive bay with bracket SAS or enterprise SATA HDD only recommended
2U Rackmount
Intel® Xeon® W-3400 series and Xeon® W-2400 series processors, Single Socket Socket E (LGA-4677) supported, CPU TDP supports Up to 350W TDP
Intel® W790
Up to 2TB RDIMM 3DS, 512GB ECC RDIMM; DDR5-4800MT/s (1DPC)/4400MT/s (2DPC), in 8 DIMM slots
8 x 3.5" hot-swap SAS3/SATA drive bay, 2 x 3.5" fixed drive bay
3 PCIe 5.0 x16 Slots, support up to 3 Single Width/2 Double Width/2 Triple Width GPU cards 1 PCIe 4.0 x4 Slots
800W Redundant Power Supply 76mm width, W/PMbus, Titaniumn
2U Rackmount
Dual Socket E2 (LGA-4710)
Intel® Xeon® 6 6700 series processors with E-cores, Up to 144C/144T; Up to 108MB Cache per CPU.
System on Chip
32 DIMM slots
Max Memory (1DPC): Up to 2TB 6400MT/s ECC DDR5 RDIMM
Max Memory (2DPC): Up to 2TB 5200MT/s ECC DDR5 RDIMM
Total 8 bay(s)
8 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bay(s)
Option A: Total 16 bay(s)
16 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bay(s)
Option B: Total 24 bay(s)
24 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bay(s)
(*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
4U Rackmount/Tower
Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor, Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support
Intel® C621
(6)+(6) DIMM slots DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel Optane DC Persistent Memory Module (DCPMM) Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS 6 Channels per CPU 1.2V
4U Tower Rackmount
Intel® Xeon® W-3400 series and Xeon® W-2400 series processors Single Socket Socket E (LGA-4677) supported, CPU TDP supports Up to 350W TDP, upto 56 cores
Intel® W790
8 DIMM slots, Up to 2TB 3DS ECC Registered RDIMM, DDR5-4800MT/s, 4800/4400 MT/s ECC DDR5 RDIMM (3DS)
Up to 2TB 3DS ECC RDIMM, 512GB ECC RDIMM; DDR5-4800MT/s(1DPC)/ 4400MT/s(2DPC), with Intel Xeon W-2400 series processor in 8 DIMM slots.
Support 8 x 3.5”/2.5”(SATA)+2x 2.5”(SSD) Fix disks
2U Rackmount
Single Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Up to 60C/120T; Up to 112.5MB Cache.
Intel® C741
8 DIMM slots Max Memory (2DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM
2U Tower Rackmount
5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots
8x 3.5"(tool-less) or 2.5"(screw) hot-swap SAS3/SATA drive bay Optional 2x 3.5" fixed drive bay, Optional rear 2x 2.5" hot-swap drive bay kit
2U Rackmount
5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
Optional 2x 2.5" hot-swap drive bay 12x 3.5" (tool-less) or 2.5" (screw) hot-swap SAS3/SATA drive bay with SES3
4U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
System on Chip
4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs
Support 8 x 3.5”/2.5”(SATA)+2x 2.5”(SSD) Fix disks
4U Rackmount
3rd Gen Intel® Xeon® Scalable processors Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Intel® C621A Chipset
16 DIMM slots Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz
Support 8 x 3.5”/2.5”(SATA)+2x 2.5”(SSD) Fix disks
4U Rackmount
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors Dual Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP, Up to 64 cores
Intel® C741 Chipset
Up to 4TB 3DS ECC RDIMM, DDR5-4800MT/s(1DPC) in 16 DIMM slots
5U Rackmount
"AMD Ryzen™ Threadripper™ PRO 7000 WX-Series and Ryzen™ Threadripper™ 7000 Series Processors
Single socket sTR5, LGA-4844, Up to 350W TDP, Overclocking supported"
AMD TRX50
"Up to 4TB of memory with speeds of 5200+MT/s (1DPC) with overclocking support
**Memory addressing up to 1TB/channel is subject to AMD Infrastructure Roadmap for Socket sTR5 Processors"
"4x 3.5"" Internal drive bay
2x 2.5"" drive bay"
"2 PCIe 5.0 x8, Open rear,
2 PCIe 5.0 x16, metal armor protection, support 2 triple/dual/single-width GPU cards,
1 PCIe 4.0 x8, MCIO connector"
2U Rackmount
5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
"8x 3.5""(tool-less) or 2.5""(screw) hot-swap SAS3/SATA drive bay
Optional 2x 3.5"" fixed drive bay,
Optional rear 2x 2.5"" hot-swap drive bay kit"
2U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s"
Intel ®C621 chipset
"Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);"
8 Hot-swap 3.5" SATA drive bays
4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots
600W platinum efficiency multiple output power supply
2U Rackmount
"Single Socket E (LGA 4677) 4th Gen Intel® Xeon® Scalable processors, Up to 60C/120T; Up to 112.5MB Cache, Note: Supports up to 350W TDP CPUs (Aircooled)"
Chipset Intel C741
"Memory Capacity: 16 DIMM slots, Up to 4TB: 16x 256 GB DRAM, Memory Type: 4800/4400MHz ECC DDR5 RDIMM"
1U Rackmount
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s Intel® C621 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
8 Hot-swap 2.5" SATA3 drive bays
1 PCI-E 3.0 x8 (FHHL) slot
600W High-Efficiency Power Supply Platinum Level Certified
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Octa Socket P (LGA 3647)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors.
8S-3 UPI up to 10.4GT/s
Support CPU TDP 70-205W
Up to 28 Cores
Intel ®C621 chipset
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel ®C622 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
4U Rackmountable / Tower
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
4U Rackmountable / Tower
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
4U Rackmountable / Tower
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
Intel ®C622 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
4U Rackmountable / Tower
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
4U Rackmount
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
Intel ®C624 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
24 Hot-swap 3.5" SAS3/SATA3 drive bays
3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8(slot 2 & 3 occupied by controller and JBOD expansion port)
1200W Redundant Power Supplies Titanium Level (96%)
4U Rackmount
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
Intel ®C624 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
36 Hot-swap 3.5" SAS3/SATA3 drive bays
3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)
1200W Redundant Power Supplies Titanium Level (96%)
4U Rackmount
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors,3 UPI up to 10.4GT/s
Intel ®C624 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
24 Hot-swap 3.5" SAS3/SATA3 drive bays
3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)
1200W Redundant Power Supplies Titanium Level (96%)
4U Rackmount
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
Intel ®C624 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
36 Hot-swap 3.5" SAS3/SATA3 drive bays
3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)
1200W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
"Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors
CPU TDP supports Up to 270W TDP
3 UPI up to 11.2 GT/s"
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz, Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz- Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slots (P1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane Persistent Memory 200 Series only)"
2U Rackmount
"3rd Gen Intel® Xeon® Scalable processors Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s"
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 4TB Intel® Optane™ Persistent Memory, DDR4-3200MHz, in 16 DIMM slots"
"Optional 2x 2.5"" hot-swap SAS3/SATA drive bay
Optional 2x 3.5"" fixed drive bay
8x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay"
2U Rackmount
Dual Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors Note Supports up to 300W TDP CPUs (Aircooled) CPUs with high TDP (air cooled) only supported under specific conditions.
Chipset Intel C741
"Memory Capacity: 16 DIMM slots Up to 4TB: 16x 256 GB DRAM Memory Type: 4800MHz ECC DDR5 RDIMM"
"8x 3.5"" hot-swap drive bay8x 3.5"" hot-swap SATA drive bays can be converted to 8x SAS drive bays by adding 1x AOC-S3908L-H8IR-16DD-0)
M.2 - 2 M.2 NVMe
Peripheral Bays - 1x slim DVD drive bays (optional)"
2U Rackmount
"Dual Socket E (LGA-4677)
5th/4th Gen Intel® Xeon® Scalable processors
Intel Xeon CPU Max Series with high bandwidth memory (HBM)
Note : Supports up to 350W TDP CPUs (Air-Cooled)
Supports up to 350W TDP CPUs (Liquid-Cooled".
"Intel® C741 chipset"
"32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-4800"
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel ®C622 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
12 Hot-swap 3.5" SAS/SATA drive bays with SES2 and Mini-i-Pass (SFF 8087) connectivity
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
6 Hot-swap 2.5" SATA3 drive bays
2 PCI-E 3.0 x16 slots
2200W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
6 Hot-swap 2.5" SAS/SATA drive bays
2 PCI-E 3.0 x16 slots
2200W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Intel ®C622 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
3 Hot-swap 3.5" SATA3 drive bays
2 PCI-E 3.0 x16 slots
2200W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
3 Hot-swap 3.5" SAS/SATA drive bays
2 PCI-E 3.0 x16 slots
2200W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
3 Hot-swap 3.5" SAS/SATA drive bays
2 PCI-E 3.0 x16 slots
2200W Redundant Power Supplies Titanium Level (96%)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel ®C621 chipset
Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
4 Hot-swap 3.5" SATA3 drive bays
1 PCI-E 3.0 x16 slot (FH, HL)
400W Redundant Platinum Power Supplies w/ BBP® option
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
2U Rackmount
"Quad Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors 3 UPI up to 16GT/s. Note : Supports 165W - 350W TDP CPUs (Aircooled)
CPUs with high TDP (air cooled) only supported under specific conditions. Contact Technical Support for details"
Intel C741
64 DIMM slots,Up to 8TB 4800MT/s ECC DDR5 RDIMM, Up to 16TB 4400MT/s ECC DDR5 RDIMM, Memory Type: 4800MHz ECC DDR5 RDIMM/RDIMM-3DS, Intel® Optane™ persistent memory 300 series
1U Rackmount
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C624 chipset
16 DIMM slotsUp to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
8 x 3.5" hot-swap SAS/SATA drive bay with SGPIO,2 x 3.5" fixed drive bay
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C622 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots(2933MHz in two DIMMs per channel supported on Rev 1.10 MB only); Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
Up to 24 Hot-swap 2.5" SAS/SATA drive bays,8x 2.5" drives supported natively
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C622 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots(2933MHz in two DIMMs per channel supported on Rev 1.10 MB only); Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
Up to 24 Hot-swap 2.5" SAS/SATA drive bays,8x 2.5" drives supported natively
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
4 Hot-swap 2.5" SAS3/SATA3 drive bays
2 PCI-E 3.0 x16 Low-profile slots, 1 SIOM card support
1000W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C624 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
12 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 165W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
6 Hot-swap 2.5" SATA3 drive bays
1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (for SIOM )
2200W Redundant Power Supplies, Titanium Level (96% Efficiency)
4U/Full Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots (2933MHz in two DIMMs per channel supported on Rev 1.10 MB only); Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
4U / Full Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
8x 3.5" SAS/SATA Backplane for Hot-Swappable Drives
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 512GB Registered ECC RDIMM
12 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C622 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
Mid Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots; Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
4 x 3.5" fixed drive bay,Optional 4 x 2.5" fixed drive bay
2 PCI-E 3.0 x8 (in x16 slot),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8 slot)
500W Bronze Level Certified High-Efficiency Power Supply
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots; Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
8 x 3.5" hot-swap SAS/SATA drive bay with SGPIO, 2 x 3.5" fixed drive bay
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 Chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
6 Hot-swap 2.5" NVMe drive bays;2 M.2 SATA3 or NVMe support
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
12 x 3.5" hot-swap SAS/SATA drive bay with SES3,Optional 2 x 2.5" hot-swap drive bay
Mid-tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C622 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
24 Hot-swap 2.5" SAS3/SATA3 direct attached drive bays
3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8,(slot 2 & 3 occupied by controller, and JBOD expansion port)
1200W Redundant Power SuppliesTitanium Level (96%)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
10 Hot-swap 2.5" drive bays,10 NVMe (4 hybrid ports for optional SAS3 via AOC)
2 PCI-E 3.0 x16 (FH, 10.5"L)
1000W Redundant Power Supplies,Titanium Level (96%)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
5U Rackmount
Intel® Xeon® W-3400 series and Xeon® W-2400 series processors
Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP,
Up to 56 cores
Intel W790
Memory Capacity: 8 DIMM slots Up to 2TB 3DS ECC Registered RDIMM, DDR5-4800MHz
Drive Bays: External 5.25" x 4, 3.5" x 1, Internal 2.5"/3.5" x 5
Tower/Convertible/5U Rackmount
5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP
Intel® C741
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
"External 5.25"" x 4, 3.5"" x 1 Internal 2.5""/3.5"" x 5"
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
4 Hot-swap 3.5" drive bays,4 SATA3 (optional SAS3 via AOC)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
2 Hot-swap 2.5" SAS/SATA drive bays
4 PCI-E 3.0 x16 slots
2000W Redundant Power Supplies Titanium Level (96%)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
4 Hot-swap 3.5" Drive Bays;Optional M.2 NVMe and SATA3 ports
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
Mid Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 chipset
Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots; Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
Tower/Convertible/Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
3U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 512GB Registered ECC RDIMM
16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
8 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays/Hot swap bays
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
8 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays/Hot swap bays
Tower/Convertible/Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
4 PCI-E 3.0 x16,2 PCI-E 3.0 x8
500W/1200W Single power supply 80 Plus Platinum Certified
3U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer), Up to 64 CoresSystem on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay
3U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)System on Chip
4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs
8x 3.5" hot-swap SAS/SATA drive bay Peripheral Drives: 1x slim DVD-ROM drive bay
Tower/Convertible/5U Rackmount
Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required),Socket SP3 Up to 240W TDP Up to 32 Cores
System on Chip
2TB Registered ECC DDR4 ,2666MHz SDRAM in 16 DIMMs
External: 5.25" x 4, 3.5" x 1 ,Internal: 3.5" or 2.5" x 5
5U Rackmount/Tower
AMD Ryzen™ 7000 series Processors
Single Socket LGA-1718 (Socket AM5) supported, CPU TDP supports Up to 170W TDP
Core
Up to 16 cores, 32 threads
System on Chip
4 DIMM slots MemoryType:5200/4800/3600 MT/s Up to 128GB of memory with speeds of up to 5200MT/s (2DPC)/ 3600MT/s (1DPC) ,DIMM Sizes
16GB, 32GB, 64GB, 128GB
External 5.25" x 4, 3.5" x 1, Internal 2.5"/3.5" x 5
4U Rackmount
AMD Ryzen™ Threadripper™ PRO 7000 WX-Series, AMD Ryzen™ Threadripper™ 7000 Series, Single Socket LGA-4844 (Socket sTR5) supported, CPU TDP supports Up to 350W TDP
Chipset TRX50
"Up to 4TB of memory with speeds of 5200+MT/s (1DPC) with overclocking support
**Memory addressing up to 1TB/channel is subject to AMD Infrastructure Roadmap for Socket sTR5 Processors"
8x 3.5"/2.5" hot-swap SAS drive bay with SES3, Peripheral bays: 3x standard 5.25" drive bay
"2 PCIe 5.0 x8, Open rear,
2 PCIe 5.0 x16, metal armor protection, support 2 triple/dual/single-width GPU cards,
1 PCIe 4.0 x8, MCIO connector, M.2 Interface: 2 PCIe 4.0 x4, RAID 0, 1
Form Factor: 2280/22110
Key: M-Key"
Tower
AMD Ryzen™ Threadripper™ PRO 7000 WX-Series, AMD Ryzen™ Threadripper™ 7000 Series, Single Socket LGA-4844 (Socket sTR5) supported, CPU TDP supports Up to 350W TDP
Chipset TRX50
"Up to 4TB of memory with speeds of 5200+MT/s (1DPC) with overclocking support
**Memory addressing up to 1TB/channel is subject to AMD Infrastructure Roadmap for Socket sTR5 Processors"
External 5.25" x 4, 3.5" x 1, Internal 2.5"/3.5" x 5
"2 PCIe 5.0 x8, Open rear,
2 PCIe 5.0 x16, metal armor protection, support 2 triple/dual/single-width GPU cards,
1 PCIe 4.0 x8, MCIO connector, M.2 Interface: 2 PCIe 4.0 x4, RAID 0, 1
Form Factor: 2280/22110
Key: M-Key"
550/1200W Redundant Power Supply , Optional : 500/1200W Single Power Supply
5U rack-mount
Intel® 8th/9th Generation Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® series Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 95W TDP
Intel® Q370
Up to 64GB Unbuffered non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots
5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
5U rack-mount
Intel® 8th/9th Generation Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® series Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 120W TDP
Intel® Z390 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2 PCI-E 3.0 x16 slots (16/NA or 8/8),
1 PCI-E 3.0 x4,3 PCI-E 3.0 x1
CPU Slot3 PCI-E 3.0 x8 (IN x16) slot and CPU Slot1 PCI-E 3.0 x4 slot share the same PCI-Ex16 link with CPU Slot6 PCI-E 3.0 x16 slot. CPU Slot6 PCI-E 3.0 x16 slot and CPU Slot3 PCI-E 3.0 x8 (IN x16) slot will change to PCI-E 3.0 x8 link and PCI-E 3.0 x4 link respectively when an add-on card is installed in CPU Slot1 PCI-E 3.0 x4 slot,M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1,M.2 Form Factor: 2242/2260/2280/22110, 2242/2260/2280
M.2 Key: M-Key, M-Key
Mid-tower
Intel® Xeon® Processor Skylake-W , Intel® Xeon® Processor W Family., Single Socket R4 (LGA 2066) supported, CPU TDP support Up to 140W
Intel® C422
Up to 256GB Registered ECC RDIMM, DDR4-2666MHz; Up to 512GB Registered ECC LRDIMM, in 8 DIMM slots
6 x 3.5" fixed drive bay,4 x 2.5" fixed drive bay
3 PCI-E 3.0 x16,1 PCI-E 3.0 x4,3xPCI-E3.0 x16 Slots(8/16/16,1xPCI-E3.0x4
M.2 Interface: 2 PCI-E 3.0 x4,M.2 Form Factor: 22110,M.2 Key: M-Key (RAID 0,1 support),M-Key for SSD and Optane(up to Intel POR). Intel VROC licence kit is needed to enable RAID.,U.2 Interface: 2 PCI-E 3.0 x4
Tower/Convertible/5U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C622
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
Tower/Convertible/5U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C622
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C622 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots(2933MHz in two DIMMs per channel supported on Rev 1.10 MB only) ;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
Tower/Convertible/5U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
Intel® C621 Chipset
"Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2 PCI-E 3.0 x8 (in x16 slot),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8 slot)
M.2 :M.2 Interface: PCI-E 3.0 x4 and SATA,Form Factor: 2280, 22110,Key: M-Key,Double Height Connector
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
12 x 3.5" hot-swap SAS/SATA drive bay with SES3
Expansion slots:2 PCI-E 3.0 x8 (in x16),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8)
920W Redundant Platinum Super Quiet power supply W/PMbus
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Quad Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 12TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 12TB 3DS ECC LRDIMM, DDR4-2933MHz, in 48 DIMM slotsUp to 12TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM in 48 DIMM slots; Up to 12TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
24 Hot-swap 3.5" SAS3/SATA3 drive bays Optional 24 SAS3 ports via AOC Optional 16 SAS3 ports via AOC + 8 NVMe ports via AOC
1 PCI-E 3.0 x32 Left Riser. 1 PCI-E 3.0 x40 Ultra Riser. 1 PCI-E 3.0 x8 in x16 slot rear Middle Riser. 1 PCI-E 3.0 x32 for 2U (or x48+x8 for 4U) on front for NVMe card support. 1 PCI-E 3.0 (x32 for 2U or x48 for 4U) on front for NVMe card support.
1600W (3+1) Redundant Power Supplies Platinum Level (96%)
3U Rack-mount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
24 x 2.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay
4U Rackmount
Intel® Xeon® Processor Skylake-W , Intel® Xeon® Processor W Family.
Single Socket LGA-2066 (Socket R4) supported, CPU TDP support Up to 140W TDP
Intel® C422
Up to 256GB Registered ECC RDIMM, DDR4-2666MHz; Up to 512GB Registered ECC LRDIMM, DDR4-2666MHz, in 8 DIMM slots
8 x 3.5" hot-swap SAS/SATA drive bay with SGPIO
3 PCI-E 3.0 x16,1 PCI-E 3.0 x4,3xPCI-E3.0 x16 Slots(8/16/16 (Skylake-W 48 lanes), 1xPCI-E3.0x4 slots,M.2 Interface: 2 PCI-E 3.0 x4,Form Factor: 22110,Key: M-Key (RAID 0,1 support),M-Key for SSD and Optane(up to Intel POR). Intel VROC licence kit is needed to enable RAID.
Mid-tower Rackmount
Intel® 8th/9th Generation Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® series Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 95W TDP
Intel® Q370
Up to 64GB Unbuffered non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots
4 x 3.5" fixed drive bay, Optional 4 x 2.5" fixed drive bay
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only)
10 x 2.5" hot-swap SAS/SATA drive bay
1 PCI-E 3.0 x32 Left Riser Slot,
1 PCI-E 3.0 x16 Right Riser Slot,
1 PCI-E 3.0 x16 for Add-On-Module (AOM)
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2242, 2260, 2280, 22110
M.2 Key: M-Key
700W/750W Platinum Power Supply W/PMbus W437xL597xH43mm