2U Rackmount
Dual Socket E (LGA 4677) 4th Gen Intel® Xeon® Scalable processors, Intel Xeon CPU Max Series with high bandwidth memory (HBM), Up to 32C/64T; Up to 112.5MB Cache Intel® C741
Memory Capacity: 16 DIMM slots Up to 4TB: 16x 256 GB DRAM Memory Type: 4800MHz ECC DDR5 RDIMM
Total 12 bays 2 front hot-swap 2.5" PCIe 5.0 NVMe/SATA drive bays 10 front hot-swap 2.5" PCIe 4.0 NVMe/SATA drive bays
Mid-Tower
AMD Ryzen™ Threadripper™ PRO 7000WX series and Ryzen™ Threadripper™ 7000 series up to 350W TDP Processors Supports optional CPU closed-looped liquid cooling kit CPU and Memory Overclocking supported System on Chip
Slot Count: 4 DIMM slots/4 Channels Max Memory (1DPC): Up to 512GB 5200MT/s ECC DDR5 RDIMM
6 internal fixed 2.5" SATA drive bays and 2 internal fixed 3.5" SATA drive bays
4U Rackmount
Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor, Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support Intel® C621A Chipset
12x DIMM slots supporting up to 1,536GBMemory, Supports Intel Optane DC Persistent Memory Module (DCPMM)
8x 3.5"/2.5" hot-swap SAS drive bay with SES3. Peripheral bays : 3x standard 5.25" drive bay
1U Rackmount
Dual Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors Intel Xeon CPU Max Series with high bandwidth memory (HBM)
Intel® C741 chipset
32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-4800
8x 2.5" hot-swap NVMe/SATA/SAS drive bays (Configurable option for 12x 2.5" hot-swap NVMe/SAS/SATA drive bays. 2 M.2 NVMe OR 2 M.2 SATA3 System Cooling
2U Rackmount
Dual processor(s) AMD EPYC™ 9005/9004 Series Processors
System on Chip (SoC)
Slot Count: 24 DIMM slots Max Memory (1DPC): Up to 9TB 6000MT/s ECC DDR5 RDIMM (AMD EPYC™ 9005 Series Processor)Max Memory (1DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM (AMD EPYC™ 9004 Series Processor)
8 front hot-swap 2.5" NVMe*/SATA* drive bays Option A: Total 24 bays 24 front hot-swap 2.5" NVMe*/SATA* drive bays
2U Rackmount
Dual AMO socket SP5 supporting AMO EPYC™ 9005/9004 Series processors, up to TOP 360W
[24) DDR5 DIMM slots, 12 channels[1 DPC). RDIMM/RIMM-3DS Max. frequency 6000MT/s Max. capacity per DIMM:RDIMM 96GB / RDIMM-3DS 256GB
[12) Hot-swap 35"/25" drive bays support [8) SATA 3.0/SAS + [4) U.2 PCle 4.0 NVMe *SAS card is required for SAS device support [2) M.2 2280 PCle3.0 x2 ports from CPU0
Riser 1:[ 1) PC le 5.0 x16 FHFL slot from CPU0 supports GPU card [1) PCle 5.0 x16 FHFL slot [x8 signal) from CPU0 [1) PCle 5.0 x16 FHHL slot [x8 signal) from CPU0 Riser 2:[1) PCle 5.0 x16 FHFL slot from CPU1 supports GPU card[1) PCle 5.0 x16 FHFL slot [x8 signal) from CPU1 [1) PCle 5.0 x16 FHHL slot [x8 signal) from CPU1 Riser 3:[1) PCle 5.0 x16 FHFL slot from CPU1 supports GPU card
2U Rackmount
4th Generation AMD EPYC™ 9004 Series Processor, Single Socket SP5, Supports up to 400W TDP CPUs (Air Cooled)* *Air Cooled CPUs with TDP over 290W only supported under specific conditions
System on Chip
24 DIMM slots with 2 DIMM per channel (up to 6TB DDR5-4000MHz(1R)/3600MHz(2R))
5U Rackmount / Tower
3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
Intel® C741
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB LRDIMM, DDR4-3200MHz Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 8 DIMM slots
External 5.25" x 4, 3.5" x 1, Internal 2.5"/3.5" x 5
2U Rackmount
Single AMD EPYC™ 9004/9005* Series Processor (*AMD EPYC™ 9005 series drop-in support requires board revision 2.x)
System on Chip
Slot Count: 12 DIMM slots Max Memory (1DPC): Up to 3TB 4800MT/s ECC DDR5 RDIMM (AMD EPYC™ 9004 Series Processor) Max Memory (1DPC): Up to 4.5TB 6000MT/s ECC DDR5 RDIMM (AMD EPYC™ 9005 Series Processor)
Total 26 bays 12 front hot-swap 3.5" SAS/SATA drive bays 12 top-loading hot-swap 3.5" SAS/SATA drive bays 2 rear hot-swap 2.5" SATA drive bays
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
1 x PCIe 4.0 x16 For CPU, 2 x PCIe 3.0 x1 For PCH 1 x Ultra M.2 Socket (M2_1, Key M), supports type 2242/2280 PCIe Gen4x4 (32 Gb/s) modes 1 x Ultra M.2 Socket (M2_2, Key M), supports type 2242/2280 SATA3 6.0 Gb/s & PCIe Gen3x4 (32 Gb/s) modes
5U Rackmount
Dual Socket BR (LGA-7529) Intel® Xeon® 6900 series processors with P-cores Core Count : Up to 128C/256T; Up to 504MB Cache per CPU Note : Supports up to 500W TDP CPUs (Air Cooled), Supports up to 500W TDP CPUs (Liquid Cooled)
System on Chip
Slot Count: 24 DIMM slots Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM, Max Memory (1DPC): Up to 6TB 8800MT/s ECC DDR5 MRDIMM
2U Rackmount
Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores Note : Supports up to 330W TDP CPUs (Air Cooled)* Supports up to 330W TDP CPUs (Liquid Cooled)
System on Chip
32 DIMM slots supporting up to 4TB of memory
8 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays Option A: Total 12 bays 12 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays
4U rackmount
Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)
Intel® C741
1U Rackmount
AMD EPYC™ 4004 series Processors Single Socket LGA-1718 (Socket AM5) supported, CPU TDP supports Up to 170W TDP, Up to 16 cores, 32 threads
Chipset B650
Up to 192GB ECC/non-ECC Unbuffered DIMM, DDR5-5200MHz, in 4 DIMM slots.
2x 2.5" fixed drive bay with bracket SAS or enterprise SATA HDD only recommended
2U Rackmount
Intel® Xeon® W-3400 series and Xeon® W-2400 series processors, Single Socket Socket E (LGA-4677) supported, CPU TDP supports Up to 350W TDP
Intel® W790
Up to 2TB RDIMM 3DS, 512GB ECC RDIMM; DDR5-4800MT/s (1DPC)/4400MT/s (2DPC), in 8 DIMM slots
8 x 3.5" hot-swap SAS3/SATA drive bay, 2 x 3.5" fixed drive bay
3 PCIe 5.0 x16 Slots, support up to 3 Single Width/2 Double Width/2 Triple Width GPU cards 1 PCIe 4.0 x4 Slots
800W Redundant Power Supply 76mm width, W/PMbus, Titaniumn
2U Rackmount
Dual Socket E2 (LGA-4710)
Intel® Xeon® 6 6700 series processors with E-cores, Up to 144C/144T; Up to 108MB Cache per CPU.
System on Chip
32 DIMM slots
Max Memory (1DPC): Up to 2TB 6400MT/s ECC DDR5 RDIMM
Max Memory (2DPC): Up to 2TB 5200MT/s ECC DDR5 RDIMM
Total 8 bay(s)
8 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bay(s)
Option A: Total 16 bay(s)
16 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bay(s)
Option B: Total 24 bay(s)
24 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bay(s)
(*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
4U Rackmount/Tower
Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor, Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support
Intel® C621
(6)+(6) DIMM slots DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel Optane DC Persistent Memory Module (DCPMM) Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS 6 Channels per CPU 1.2V
4U Tower Rackmount
Intel® Xeon® W-3400 series and Xeon® W-2400 series processors Single Socket Socket E (LGA-4677) supported, CPU TDP supports Up to 350W TDP, upto 56 cores
Intel® W790
8 DIMM slots, Up to 2TB 3DS ECC Registered RDIMM, DDR5-4800MT/s, 4800/4400 MT/s ECC DDR5 RDIMM (3DS)
Up to 2TB 3DS ECC RDIMM, 512GB ECC RDIMM; DDR5-4800MT/s(1DPC)/ 4400MT/s(2DPC), with Intel Xeon W-2400 series processor in 8 DIMM slots.
Support 8 x 3.5”/2.5”(SATA)+2x 2.5”(SSD) Fix disks
2U Rackmount
Single Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Up to 60C/120T; Up to 112.5MB Cache.
Intel® C741
8 DIMM slots Max Memory (2DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM
2U Tower Rackmount
5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots
8x 3.5"(tool-less) or 2.5"(screw) hot-swap SAS3/SATA drive bay Optional 2x 3.5" fixed drive bay, Optional rear 2x 2.5" hot-swap drive bay kit
2U Rackmount
5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
Optional 2x 2.5" hot-swap drive bay 12x 3.5" (tool-less) or 2.5" (screw) hot-swap SAS3/SATA drive bay with SES3
4U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
System on Chip
4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs
Support 8 x 3.5”/2.5”(SATA)+2x 2.5”(SSD) Fix disks
4U Rackmount
3rd Gen Intel® Xeon® Scalable processors Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Intel® C621A Chipset
16 DIMM slots Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz
Support 8 x 3.5”/2.5”(SATA)+2x 2.5”(SSD) Fix disks
4U Rackmount
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors Dual Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP, Up to 64 cores
Intel® C741 Chipset
Up to 4TB 3DS ECC RDIMM, DDR5-4800MT/s(1DPC) in 16 DIMM slots
5U Rackmount
"AMD Ryzen™ Threadripper™ PRO 7000 WX-Series and Ryzen™ Threadripper™ 7000 Series Processors
Single socket sTR5, LGA-4844, Up to 350W TDP, Overclocking supported"
AMD TRX50
"Up to 4TB of memory with speeds of 5200+MT/s (1DPC) with overclocking support
**Memory addressing up to 1TB/channel is subject to AMD Infrastructure Roadmap for Socket sTR5 Processors"
"4x 3.5"" Internal drive bay
2x 2.5"" drive bay"
"2 PCIe 5.0 x8, Open rear,
2 PCIe 5.0 x16, metal armor protection, support 2 triple/dual/single-width GPU cards,
1 PCIe 4.0 x8, MCIO connector"
2U Rackmount
5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
"8x 3.5""(tool-less) or 2.5""(screw) hot-swap SAS3/SATA drive bay
Optional 2x 3.5"" fixed drive bay,
Optional rear 2x 2.5"" hot-swap drive bay kit"
2U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s"
Intel ®C621 chipset
"Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);"
8 Hot-swap 3.5" SATA drive bays
4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots
600W platinum efficiency multiple output power supply
2U Rackmount
"Single Socket E (LGA 4677) 4th Gen Intel® Xeon® Scalable processors, Up to 60C/120T; Up to 112.5MB Cache, Note: Supports up to 350W TDP CPUs (Aircooled)"
Chipset Intel C741
"Memory Capacity: 16 DIMM slots, Up to 4TB: 16x 256 GB DRAM, Memory Type: 4800/4400MHz ECC DDR5 RDIMM"
1U Rackmount
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s Intel® C621 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
8 Hot-swap 2.5" SATA3 drive bays
1 PCI-E 3.0 x8 (FHHL) slot
600W High-Efficiency Power Supply Platinum Level Certified
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Octa Socket P (LGA 3647)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors.
8S-3 UPI up to 10.4GT/s
Support CPU TDP 70-205W
Up to 28 Cores
Intel ®C621 chipset
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel ®C622 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
4U Rackmountable / Tower
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
4U Rackmountable / Tower
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
4U Rackmountable / Tower
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
Intel ®C622 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
4U Rackmountable / Tower
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
4U Rackmount
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
Intel ®C624 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
24 Hot-swap 3.5" SAS3/SATA3 drive bays
3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8(slot 2 & 3 occupied by controller and JBOD expansion port)
1200W Redundant Power Supplies Titanium Level (96%)
4U Rackmount
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
Intel ®C624 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
36 Hot-swap 3.5" SAS3/SATA3 drive bays
3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)
1200W Redundant Power Supplies Titanium Level (96%)
4U Rackmount
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors,3 UPI up to 10.4GT/s
Intel ®C624 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
24 Hot-swap 3.5" SAS3/SATA3 drive bays
3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)
1200W Redundant Power Supplies Titanium Level (96%)
4U Rackmount
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
Intel ®C624 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
36 Hot-swap 3.5" SAS3/SATA3 drive bays
3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)
1200W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
"Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors
CPU TDP supports Up to 270W TDP
3 UPI up to 11.2 GT/s"
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz, Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz- Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slots (P1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane Persistent Memory 200 Series only)"
2U Rackmount
"3rd Gen Intel® Xeon® Scalable processors Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s"
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 4TB Intel® Optane™ Persistent Memory, DDR4-3200MHz, in 16 DIMM slots"
"Optional 2x 2.5"" hot-swap SAS3/SATA drive bay
Optional 2x 3.5"" fixed drive bay
8x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay"
2U Rackmount
Dual Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors Note Supports up to 300W TDP CPUs (Aircooled) CPUs with high TDP (air cooled) only supported under specific conditions.
Chipset Intel C741
"Memory Capacity: 16 DIMM slots Up to 4TB: 16x 256 GB DRAM Memory Type: 4800MHz ECC DDR5 RDIMM"
"8x 3.5"" hot-swap drive bay8x 3.5"" hot-swap SATA drive bays can be converted to 8x SAS drive bays by adding 1x AOC-S3908L-H8IR-16DD-0)
M.2 - 2 M.2 NVMe
Peripheral Bays - 1x slim DVD drive bays (optional)"
2U Rackmount
"Dual Socket E (LGA-4677)
5th/4th Gen Intel® Xeon® Scalable processors
Intel Xeon CPU Max Series with high bandwidth memory (HBM)
Note : Supports up to 350W TDP CPUs (Air-Cooled)
Supports up to 350W TDP CPUs (Liquid-Cooled".
"Intel® C741 chipset"
"32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-4800"
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel ®C622 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
12 Hot-swap 3.5" SAS/SATA drive bays with SES2 and Mini-i-Pass (SFF 8087) connectivity
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
6 Hot-swap 2.5" SATA3 drive bays
2 PCI-E 3.0 x16 slots
2200W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
6 Hot-swap 2.5" SAS/SATA drive bays
2 PCI-E 3.0 x16 slots
2200W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Intel ®C622 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
3 Hot-swap 3.5" SATA3 drive bays
2 PCI-E 3.0 x16 slots
2200W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
3 Hot-swap 3.5" SAS/SATA drive bays
2 PCI-E 3.0 x16 slots
2200W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Intel ®C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
3 Hot-swap 3.5" SAS/SATA drive bays
2 PCI-E 3.0 x16 slots
2200W Redundant Power Supplies Titanium Level (96%)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel ®C621 chipset
Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
4 Hot-swap 3.5" SATA3 drive bays
1 PCI-E 3.0 x16 slot (FH, HL)
400W Redundant Platinum Power Supplies w/ BBP® option
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
2U Rackmount
"Quad Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors 3 UPI up to 16GT/s. Note : Supports 165W - 350W TDP CPUs (Aircooled)
CPUs with high TDP (air cooled) only supported under specific conditions. Contact Technical Support for details"
Intel C741
64 DIMM slots,Up to 8TB 4800MT/s ECC DDR5 RDIMM, Up to 16TB 4400MT/s ECC DDR5 RDIMM, Memory Type: 4800MHz ECC DDR5 RDIMM/RDIMM-3DS, Intel® Optane™ persistent memory 300 series
1U Rackmount
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C624 chipset
16 DIMM slotsUp to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
8 x 3.5" hot-swap SAS/SATA drive bay with SGPIO,2 x 3.5" fixed drive bay
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C622 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots(2933MHz in two DIMMs per channel supported on Rev 1.10 MB only); Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
Up to 24 Hot-swap 2.5" SAS/SATA drive bays,8x 2.5" drives supported natively
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C622 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots(2933MHz in two DIMMs per channel supported on Rev 1.10 MB only); Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
Up to 24 Hot-swap 2.5" SAS/SATA drive bays,8x 2.5" drives supported natively
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
4 Hot-swap 2.5" SAS3/SATA3 drive bays
2 PCI-E 3.0 x16 Low-profile slots, 1 SIOM card support
1000W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C624 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
12 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 165W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
6 Hot-swap 2.5" SATA3 drive bays
1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (for SIOM )
2200W Redundant Power Supplies, Titanium Level (96% Efficiency)
4U/Full Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots (2933MHz in two DIMMs per channel supported on Rev 1.10 MB only); Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
4U / Full Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
8x 3.5" SAS/SATA Backplane for Hot-Swappable Drives
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 512GB Registered ECC RDIMM
12 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C622 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
Mid Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots; Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
4 x 3.5" fixed drive bay,Optional 4 x 2.5" fixed drive bay
2 PCI-E 3.0 x8 (in x16 slot),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8 slot)
500W Bronze Level Certified High-Efficiency Power Supply
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots; Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
8 x 3.5" hot-swap SAS/SATA drive bay with SGPIO, 2 x 3.5" fixed drive bay
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 Chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
6 Hot-swap 2.5" NVMe drive bays;2 M.2 SATA3 or NVMe support
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
12 x 3.5" hot-swap SAS/SATA drive bay with SES3,Optional 2 x 2.5" hot-swap drive bay
Mid-tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C622 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
24 Hot-swap 2.5" SAS3/SATA3 direct attached drive bays
3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8,(slot 2 & 3 occupied by controller, and JBOD expansion port)
1200W Redundant Power SuppliesTitanium Level (96%)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
10 Hot-swap 2.5" drive bays,10 NVMe (4 hybrid ports for optional SAS3 via AOC)
2 PCI-E 3.0 x16 (FH, 10.5"L)
1000W Redundant Power Supplies,Titanium Level (96%)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
Tower / 5U Rackmount
Intel® Xeon® W-3400 series and Xeon® W-2400 series processors
Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP,
Up to 56 cores
Intel W790
Memory Capacity: 8 DIMM slots Up to 2TB 3DS ECC Registered RDIMM, DDR5-4800MHz
Drive Bays: External 5.25" x 4, 3.5" x 1, Internal 2.5"/3.5" x 5
Tower/Convertible/5U Rackmount
5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP
Intel® C741
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
"External 5.25"" x 4, 3.5"" x 1 Internal 2.5""/3.5"" x 5"
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
4 Hot-swap 3.5" drive bays,4 SATA3 (optional SAS3 via AOC)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
2 Hot-swap 2.5" SAS/SATA drive bays
4 PCI-E 3.0 x16 slots
2000W Redundant Power Supplies Titanium Level (96%)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
4 Hot-swap 3.5" Drive Bays;Optional M.2 NVMe and SATA3 ports
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
Mid Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 chipset
Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots; Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
Tower/Convertible/Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
3U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 512GB Registered ECC RDIMM
16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
8 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays/Hot swap bays
Tower/Convertible/5U Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621
8 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays/Hot swap bays
Tower/Convertible/Rackmount
Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3 x 5.25" bays to 4 x hot-plug SAS/SATA 12G LFF bays
4 PCI-E 3.0 x16,2 PCI-E 3.0 x8
500W/1200W Single power supply 80 Plus Platinum Certified
3U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer), Up to 64 CoresSystem on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay
3U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)System on Chip
4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs
8x 3.5" hot-swap SAS/SATA drive bay Peripheral Drives: 1x slim DVD-ROM drive bay
Tower/Convertible/5U Rackmount
Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required),Socket SP3 Up to 240W TDP Up to 32 Cores
System on Chip
2TB Registered ECC DDR4 ,2666MHz SDRAM in 16 DIMMs
External: 5.25" x 4, 3.5" x 1 ,Internal: 3.5" or 2.5" x 5
5U Rackmount/Tower
AMD Ryzen™ 7000 series Processors
Single Socket LGA-1718 (Socket AM5) supported, CPU TDP supports Up to 170W TDP
Core
Up to 16 cores, 32 threads
System on Chip
4 DIMM slots MemoryType:5200/4800/3600 MT/s Up to 128GB of memory with speeds of up to 5200MT/s (2DPC)/ 3600MT/s (1DPC) ,DIMM Sizes
16GB, 32GB, 64GB, 128GB
External 5.25" x 4, 3.5" x 1, Internal 2.5"/3.5" x 5
4U Rackmount
AMD Ryzen™ Threadripper™ PRO 7000 WX-Series, AMD Ryzen™ Threadripper™ 7000 Series, Single Socket LGA-4844 (Socket sTR5) supported, CPU TDP supports Up to 350W TDP
Chipset TRX50
"Up to 4TB of memory with speeds of 5200+MT/s (1DPC) with overclocking support
**Memory addressing up to 1TB/channel is subject to AMD Infrastructure Roadmap for Socket sTR5 Processors"
8x 3.5"/2.5" hot-swap SAS drive bay with SES3, Peripheral bays: 3x standard 5.25" drive bay
"2 PCIe 5.0 x8, Open rear,
2 PCIe 5.0 x16, metal armor protection, support 2 triple/dual/single-width GPU cards,
1 PCIe 4.0 x8, MCIO connector, M.2 Interface: 2 PCIe 4.0 x4, RAID 0, 1
Form Factor: 2280/22110
Key: M-Key"
Tower
AMD Ryzen™ Threadripper™ PRO 7000 WX-Series, AMD Ryzen™ Threadripper™ 7000 Series, Single Socket LGA-4844 (Socket sTR5) supported, CPU TDP supports Up to 350W TDP
Chipset TRX50
"Up to 4TB of memory with speeds of 5200+MT/s (1DPC) with overclocking support
**Memory addressing up to 1TB/channel is subject to AMD Infrastructure Roadmap for Socket sTR5 Processors"
External 5.25" x 4, 3.5" x 1, Internal 2.5"/3.5" x 5
"2 PCIe 5.0 x8, Open rear,
2 PCIe 5.0 x16, metal armor protection, support 2 triple/dual/single-width GPU cards,
1 PCIe 4.0 x8, MCIO connector, M.2 Interface: 2 PCIe 4.0 x4, RAID 0, 1
Form Factor: 2280/22110
Key: M-Key"
550/1200W Redundant Power Supply , Optional : 500/1200W Single Power Supply
5U rack-mount
Intel® 8th/9th Generation Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® series Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 95W TDP
Intel® Q370
Up to 64GB Unbuffered non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots
5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
5U rack-mount
Intel® 8th/9th Generation Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® series Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 120W TDP
Intel® Z390 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2 PCI-E 3.0 x16 slots (16/NA or 8/8),
1 PCI-E 3.0 x4,3 PCI-E 3.0 x1
CPU Slot3 PCI-E 3.0 x8 (IN x16) slot and CPU Slot1 PCI-E 3.0 x4 slot share the same PCI-Ex16 link with CPU Slot6 PCI-E 3.0 x16 slot. CPU Slot6 PCI-E 3.0 x16 slot and CPU Slot3 PCI-E 3.0 x8 (IN x16) slot will change to PCI-E 3.0 x8 link and PCI-E 3.0 x4 link respectively when an add-on card is installed in CPU Slot1 PCI-E 3.0 x4 slot,M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1,M.2 Form Factor: 2242/2260/2280/22110, 2242/2260/2280
M.2 Key: M-Key, M-Key
Mid-tower
Intel® Xeon® Processor Skylake-W , Intel® Xeon® Processor W Family., Single Socket R4 (LGA 2066) supported, CPU TDP support Up to 140W
Intel® C422
Up to 256GB Registered ECC RDIMM, DDR4-2666MHz; Up to 512GB Registered ECC LRDIMM, in 8 DIMM slots
6 x 3.5" fixed drive bay,4 x 2.5" fixed drive bay
3 PCI-E 3.0 x16,1 PCI-E 3.0 x4,3xPCI-E3.0 x16 Slots(8/16/16,1xPCI-E3.0x4
M.2 Interface: 2 PCI-E 3.0 x4,M.2 Form Factor: 22110,M.2 Key: M-Key (RAID 0,1 support),M-Key for SSD and Optane(up to Intel POR). Intel VROC licence kit is needed to enable RAID.,U.2 Interface: 2 PCI-E 3.0 x4
Tower/Convertible/5U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C622
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
Tower/Convertible/5U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C622
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C622 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots(2933MHz in two DIMMs per channel supported on Rev 1.10 MB only) ;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
Tower/Convertible/5U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
Intel® C621 Chipset
"Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2 PCI-E 3.0 x8 (in x16 slot),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8 slot)
M.2 :M.2 Interface: PCI-E 3.0 x4 and SATA,Form Factor: 2280, 22110,Key: M-Key,Double Height Connector
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
12 x 3.5" hot-swap SAS/SATA drive bay with SES3
Expansion slots:2 PCI-E 3.0 x8 (in x16),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8)
920W Redundant Platinum Super Quiet power supply W/PMbus
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Quad Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 12TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 12TB 3DS ECC LRDIMM, DDR4-2933MHz, in 48 DIMM slotsUp to 12TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM in 48 DIMM slots; Up to 12TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
24 Hot-swap 3.5" SAS3/SATA3 drive bays Optional 24 SAS3 ports via AOC Optional 16 SAS3 ports via AOC + 8 NVMe ports via AOC
1 PCI-E 3.0 x32 Left Riser. 1 PCI-E 3.0 x40 Ultra Riser. 1 PCI-E 3.0 x8 in x16 slot rear Middle Riser. 1 PCI-E 3.0 x32 for 2U (or x48+x8 for 4U) on front for NVMe card support. 1 PCI-E 3.0 (x32 for 2U or x48 for 4U) on front for NVMe card support.
1600W (3+1) Redundant Power Supplies Platinum Level (96%)
3U Rack-mount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
24 x 2.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay
4U Rackmount
Intel® Xeon® Processor Skylake-W , Intel® Xeon® Processor W Family.
Single Socket LGA-2066 (Socket R4) supported, CPU TDP support Up to 140W TDP
Intel® C422
Up to 256GB Registered ECC RDIMM, DDR4-2666MHz; Up to 512GB Registered ECC LRDIMM, DDR4-2666MHz, in 8 DIMM slots
8 x 3.5" hot-swap SAS/SATA drive bay with SGPIO
3 PCI-E 3.0 x16,1 PCI-E 3.0 x4,3xPCI-E3.0 x16 Slots(8/16/16 (Skylake-W 48 lanes), 1xPCI-E3.0x4 slots,M.2 Interface: 2 PCI-E 3.0 x4,Form Factor: 22110,Key: M-Key (RAID 0,1 support),M-Key for SSD and Optane(up to Intel POR). Intel VROC licence kit is needed to enable RAID.
Mid-tower Rackmount
Intel® 8th/9th Generation Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® series Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 95W TDP
Intel® Q370
Up to 64GB Unbuffered non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots
4 x 3.5" fixed drive bay, Optional 4 x 2.5" fixed drive bay
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only)
10 x 2.5" hot-swap SAS/SATA drive bay
1 PCI-E 3.0 x32 Left Riser Slot,
1 PCI-E 3.0 x16 Right Riser Slot,
1 PCI-E 3.0 x16 for Add-On-Module (AOM)
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2242, 2260, 2280, 22110
M.2 Key: M-Key
700W/750W Platinum Power Supply W/PMbus W437xL597xH43mm
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz Or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots; Xeon-W 32xx supports up to 2TB 3DS ECC RDIMM/LRDIMM, Xeon-W 32xx supports up to 1TB 3DS RDIMM/LRDIMM. ;Xeon-W32xx series processors don't support DCPMM.
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
4 PCI-E 3.0 x16,
3 PCI-E 3.0 x8 (in x16 slot),
PCI-Ex16 Slot#1 shares with M.2, Slot#2 shares with Slot#3(NA/16,8/8), Slot#4 shares with Slot#5(NA/16,8/8), Slot#6 shares with Slot#7(NA/16,8/8)
(16/NA/16/NA/16/NA/16 or 16/8/8/8/8/8/8)
M.2 Interface: 4 PCI-E 3.0 x4, RAID 0 & 1
M.2 Form Factor: 2242/2260/2280/22110
M.2 Key: M-Key
M.2 shares PCI-E lanes with PCI-Ex16 slot#1, VROC key is required for Raid.
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz Or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots; Xeon-W 32xx supports up to 2TB 3DS ECC RDIMM/LRDIMM, Xeon-W 32xx supports up to 1TB 3DS RDIMM/LRDIMM. ;Xeon-W32xx series processors don't support DCPMM.
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
4 PCI-E 3.0 x16,
3 PCI-E 3.0 x8 (in x16 slot),
PCI-Ex16 Slot#1 shares with M.2, Slot#2 shares with Slot#3(NA/16,8/8), Slot#4 shares with Slot#5(NA/16,8/8), Slot#6 shares with Slot#7(NA/16,8/8)
(16/NA/16/NA/16/NA/16 or 16/8/8/8/8/8/8)
M.2 Interface: 4 PCI-E 3.0 x4, RAID 0 & 1
M.2 Form Factor: 2242/2260/2280/22110
M.2 Key: M-Key
M.2 shares PCI-E lanes with PCI-Ex16 slot#1, VROC key is required for Raid.
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
4U Rackmount
Intel® Xeon® Scalable Processors, Intel® Xeon® W-32xx Processor.
Single Socket LGA-3647 (Socket P) supported, CPU TDP support 205W TDP
Intel® C621
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz Or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots;Xeon-W 32xx supports up to 2TB 3DS ECC RDIMM/LRDIMM, Xeon-W 32xx supports up to 1TB 3DS RDIMM/LRDIMM. ;Xeon-W32xx series processors don't support DCPMM.
5 x 3.5" hot-swap SAS3/SATA drive bay
4 PCI-E 3.0 x16,
3 PCI-E 3.0 x8 (in x16 slot),
PCI-Ex16 Slot#1 shares with M.2, Slot#2 shares with Slot#3(NA/16,8/8), Slot#4 shares with Slot#5(NA/16,8/8), Slot#6 shares with Slot#7(NA/16,8/8)
(16/NA/16/NA/16/NA/16 or 16/8/8/8/8/8/8),M.2 Interface: 4 PCI-E 3.0 x4, RAID 0 & 1
M.2 Form Factor,2242/2260/2280/22110
M.2 Key: M-Key,M.2 shares PCI-E lanes with PCI-Ex16 slot#1, VROC key is required for Raid.
800W Redundant Power Supplies Platinum Level (94%)
2U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)Socket SP3, Support CPU TDP / cTDP up to 200W*, Up to 64 Cores
Note : Certain CPUs with high TDP may be supported only under specific conditions. Please contact TyroneTechnical Support for additional information about specialized system optimization
System on Chip
Up to 4TB ECC 3DS LRDIMM,up to DDR4-3200MHz; 16 DIMM slots
2U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor
(7003 Series Processor drop-in support requires BIOS version 2.0 or newer)Socket SP3, Supports CPU TDP / cTDP up to 280W, Up to 64 Cores
Note : Certain CPUs with high TDP may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
System on Chip
Up to 2TB ECC 3DS LRDIMM,up to DDR4-3200MHz; 8 DIMM slots
3 Hot-swap 3.5" SATA3 drive bays
2 PCI-E 4.0 (x16) Low-profile slots,1 SIOM card support
(must bundle with network card)
M.2 Interface: 1 SATA/PCI-E 3.0 x4, Form Factor: 2280, 22110
Key: M-key
2000W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
"AMD EPYC™ 9004 series Processors
Single Socket SP5 supported, CPU TDP supports Up to 400W TDP, Up to 128 cores, 256 threads"
System on Chip
"12 DIMM slots Up to 3TB 3DS ECC Registered RDIMM, DDR5-4800MHz"
"8x 3.5""(tool-less) or 2.5""(screw) hot-swap SAS3/SATA drive bay
Optional 2x 3.5"" fixed drive bay, Optional rear 2x 2.5"" hot-swap drive bay kit"
2U Rackmount
Single AMD EPYC™ 9004/9005* Series Processor
(*AMD EPYC™ 9005 series drop-in support requires board revision 2.x)
System on Chip
"Slot Count: 12 DIMM slots" Max Memory (1DPC): Up to 3TB 4800MT/s ECC DDR5 RDIMM (AMD EPYC™ 9004 Series Processor) Max Memory (1DPC): Up to 4.5TB 6000MT/s ECC DDR5 RDIMM (AMD EPYC™ 9005 Series Processor) Max Memory (1DPC): Up to 4.5TB 6000MT/s ECC DDR5 RDIMM (AMD EPYC™ 9005 Series Processor)
2U Rackmount
"AMD EPYC™ 9004 series Processors
Single Socket SP5 supported, CPU TDP supports Up to 400W TDP, Up to 128 cores, 256 threads"
System on Chip
"12 DIMM slots Up to 3TB 3DS ECC Registered RDIMM, DDR5-4800MHz""
"24 x 2.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay"
1U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Support CPU TDP up to 280W, Up to 64 Cores
System on Chip
8 DIMMs; up to 2TB 3DS ECC,DDR4-3200MHz RDIMM/LRDIMM
1U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer),Socket SP3 Support CPU TDP up to 280W, Up to 64 Cores
System on Chip
8 DIMMs; up to 2TB 3DS ECC, DDR4-3200MHz RDIMM/LRDIMM
10 Hot-swap 2.5" SATA3 drive bays
Optional 2 U.2 NVMe (PCI-E 3.0) drive support via additional kit for NVMe devices
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only);
8 x 3.5" hot-swap SAS3/SATA drive bay
2 x 3.5" fixed drive bay
1U Rackmountable
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
8 x 2.5" hot-swap SAS/SATA drive bay
2 PCI-E 3.0 x8 (in x16 slot),4 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8 slot)
M.2 :M.2 Interface: PCI-E 3.0 x4 and SATA,Form Factor: 2280, 22110,Key: M-Key,Double Height Connector
1U 600W Redundant Single Output Power Supply w/PMBus, short depth, W54.5xL220xH40
5U Rackmount/Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only);
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
5U Rackmount/Tower
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
12x DIMM slots supporting up to 1,536GBMemory, Supports Intel Optane DC Persistent Memory Module (DCPMM)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
5U Rackmount/Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only);
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
1U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s"
Intel® C621 chipset
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
4 Hot-swap 2.5" SAS3/SATA3 drive bays
2 PCI-E 3.0 x16 Low-profile slots, 1 SIOM card support
1000W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required),Socket SP3, Up to 32 Cores, Up to 64 Cores (Board revision 2.x required)
"
System on Chip (SoC)
1U Rackmount
"Intel® Xeon® processor D-2146NT, CPU TDP support 80W, 8 Cores, 16 Threads
"
System on Chip (SoC)
Up to 512GB DDR4 ECC LRDIMM, Up to 256GB DDR4 ECC RDIMM 4 DIMM slots
Memory Type :2666/2400/2133MHz ECC DDR4 L/RDIMM
Operating speed up to 2133MHz
2x 2.5"" drive bays (one drive space shares with M.2)
4 PCI-E 3.0 x8 slots for AIOM (AIOM is sold separately, it is not included in this standard/barebone system)
M.2
2 M.2 M-Key 2280/22110 (space share with one 2.5"" drive bay)
1 M.2 E-Key 2230
1 M.2 B-Key 3042
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
8 x 3.5"" hot-swap SAS3/SATA drive bay, 2 x 3.5"" fixed drive bay
5U Rackmount/Tower
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
4U Rackmount/Tower
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
Tower/Convertable/ 5U Rackmount
Intel® Xeon® W-2100 Processors., Single Socket LGA-2066 (Socket R4) supported, CPU TDP support Up to 140W TDP
Intel® C422
Up to 256GB ECC RDIMM, DDR4-2666MHz; Up to 512GB ECC LRDIMM, DDR4-2666MHz, in 8 DIMM slots
Drive bays:External:5.25" x 4, 3.5" x 1,Internal: 3.5" or 2.5" x 5
Tower/Convertable/ 5U Rackmount
Intel® Xeon® W-2100 Processors., Single Socket LGA-2066 (Socket R4) supported, CPU TDP support Up to 140W TDP
Intel® C422
Up to 256GB ECC RDIMM, DDR4-2666MHz; Up to 512GB ECC LRDIMM, DDR4-2666MHz, in 8 DIMM slots
Drive bays:External:5.25" x 4, 3.5" x 1,Internal: 3.5" or 2.5" x 5
2U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s"
Intel® C621 chipset
"Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);"
4 Hot-swap 2.5"" NVMe/SATA3 + 2 Hot-swap 2.5"" SATA3 drive bays
M.:21 M.2 NVMe or SATA (2280/22110)
3U Rackmount
LGA1700 socket: Support for 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processor, L3 cache varies with CPU
Intel® H610 Express Chipset
Support for DDR4 3200/3000/2933/2666/2400/2133 MHz memory modules, 2 x DDR4 DIMM sockets supporting up to 64 GB (32 GB single DIMM capacity) of system memory,
2x2.5"/3.5" Drive bays
1x PCI Express x16 slot, running at x16, , 1 x PCI Express x1 slot
1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 3.0 x4/x2 SSD support), 4 x SATA 6Gb/s connectors
2U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) Socket SP3 Support CPU TDP up to 280W
System on Chip (SoC)
16 DIMM slots Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM 8-channel memory bus
Up to 24 hot-swap 2.5" U.2 NVMe drive bays
Up to 2 PCI-E 4.0 x16 (FH/HL) slots: 24-NVMe configuration (Standard) – 1 slot available 20-NVMe configuration – 2 slots available
M.2 Interface: 2 PCI-E 4.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: Onboard M-key
1200W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)
Tower/5U Rackmount
3rd Gen Intel® Xeon® Scalable processors Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Intel® C621A
Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 6TB Intel® Optane™ Persistent Memory, DDR4-3200MHz, in 16 DIMM slots; Up to 6TB Intel® Optane DC Persistent Memory in memory mode.
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
3U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)Socket SP3
System on Chip
8 DIMM slots, Supports up to 2TB Registered ECC DDR4 3200MHz SDRAM ,8-channel memory bus
3U Rackmount
3rd Gen Intel® Xeon® Scalable processors Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
8x 3.5" hot-swap SAS/SATA drive bay. Peripheral Drives- 1x slim DVD-ROM drive bay 2x standard 5.25" drive bay
2U Rackmount
Intel Single Socket LGA 1700 for 13th Gen Intel® Core™ Processors, and 12th Gen Intel® Core™, Pentium® Gold, and Celeron® Processors
Intel® Z790 Chipset
4 x DIMM, Max. 192GB, DDR5 7800+
8 x 3.5" hot-swap SAS3/SATA drive bay, 2 x 3.5" fixed drive bay
Intel® 13th & 12th Gen Processors- 1 x PCIe 5.0 x16 slot, Intel® Z790 Chipset-2 x PCIe 4.0 x16 slots (support x4 mode). When M.2_1 is occupied with SSD device, PCIEX16(G5) will run x8 only.
1U Rackmount
Single Socket E (LGA 4677) 4th Gen Intel® Xeon® Scalable processors, Up to 52C/104T; Up to 97.5MB Cache Note : Supports up to 300W TDP CPUs (Aircooled)
Intel C741 Chipset
Memory Capacity: 8 DIMM slots Up to 2TB: 8x 256 GB DRAM Memory Type: 4800/4400MHz ECC DDR5 RDIMM
2U Rackmount
"Supports two 4th Gen Intel® Xeon® Scalable or Intel Xeon CPU Max Series processors with 16 DDR5 DIMMs and up to four Intel® Data Center GPU Max Series modules
"
"
Intel® C741 Chipset
"
2U Rackmount
Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
16 x 2.5" hot-swap SAS3/SATA drive bay, 1 x 5.25" drive bay
4U Rackmount/Tower
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
10U Rackmount
"Dual Socket P (LGA 3647)Intel® Xeon® Scalable Processors,
3 UPI up to 10.4GT/s, Support CPU TDP 205W, Cores Up to 28 Cores, GPU Supports 16 V100 SXM3 350W
"
Intel® C621 chipset
24 DIMM slots, Up to 3TB 3DS ECC L/RDIMM, up to DDR4-2666MHz
Memory Type 2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
16 Hot-swap 2.5"" NVMe drive bays *
6 Hot-swap 2.5"" SATA3 drive bays
M.2
M.2 Interface: 2 PCI-E 3.0 x4
Form Factors: 2280, 22110
Key: M-Key
Note * NVMe hot-swap feature doesn't work in Windows environment
16 PCI-E 3.0 x16 for RDMA via IB EDR
2 PCI-E 3.0 x16 on motherboard
6x (5+1) 3000W Redundant Power
Supplies; Titanium Level (96%+)
4U Rackmount
Single Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡
Intel® Xeon® W-32xx Processors
Support CPU TDP up to 205W
Up to 28 Cores BIOS version 3.0b or above is required to support 2nd Gen. Intel® Xeon® Scalable processors
Intel® C621
12 DIMM slots
Intel® Xeon® Scalable Processors: Support up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots.
Intel® Xeon® W-3200 Processors: Support up to 2TB 3DS ECC RDIMM/LRDIMM; up to 1TB 3DS RDIMM/LRDIMM. (Xeon® W-3200 doesn't support DCPMM.)
Mid Tower
"Single Socket H4 (LGA 1151),CPU TDP support up to 95W Support Intel® Xeon® processor E-2100 / E-2200 series,
8th Gen. Intel® Core™ i3 Processors,
Intel® Celeron®, Intel® Pentium®
"
Intel® C242 chipset
4 DIMM slots Up to 128GB ECC UDIMM
Up to DDR4-2666MHz Memory Type
2666/2400/2133MHz ECC DDR4 SDRAM
DIMM Sizes 32GB, 16GB, 8GB
Note: Future support for 128GB via BIOS update expected in early 2019
Tower/5U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
"
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 6TB Intel® Optane™ Persistent Memory, DDR4-3200MHz, in 16 DIMM slots;
Up to 6TB Intel® Optane DC Persistent Memory in memory mode."
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor
Tower/Convertible/5U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
"Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Note : BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP
"
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
16 x 3.5"" hot-swap SAS3/SATA drive bay
Optional 2 x 2.5"" hot-swap SAS3/SATA drive bay
4U Rackmount
Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)
Intel® C741 Chipset, Aspeed 2600 series BMC
Slot Count: 32 DIMM slots, Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM)
60 x 3.5" Top Loading Bays (SAS/SATA) with expander backplane
Upto 4 x PCIe 5.0 x16 or upto 6 x PCIe 5.0 x8 Supports upto 4 x Network Cards (x4, x8, x16) or Video Cards, Supports upto 4 x Storage Cards
Redundant & Hot-Swappable 80+ Titanium Power Supply (2000W/2400W)
4U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required), Socket SP3
Cores Up to 32 Cores Up to 64 Cores (Board revision 2.x required)
"
System on Chip
4U Rackmount
"
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
"
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
1U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Up to 28 Cores Note : BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors"
" Intel® C621 chipset
"
24 DIMM slots
Up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only);
36 x 3.5"" hot-swap SAS/SATA drive bay with SES3
Optional 2 x 2.5"" hot-swap drive bay
3U Rackmount
"Dual Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡,
3 UPI up to 10.4GT/s, Support CPU TDP 205W
"
Intel® C621
16 DIMM slots, Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
1U Rackmount
"Single AMD EPYC™ 7001/7002* series Processor (*Board revision 2.x required) Socket SP3
Supports CPU TDP 225W / cTDP up to 240W*
"
System on Chip (SoC)
1U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
"Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
4 hot-swap 3.5" SATA3 drive bays
"2 PCI-E 3.0 x8 (in x16),
4 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)"
400W Redundant Power Supply Platinum with PMBUS, W54.5xL220xH40mm
Tower/Convertible/5U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 Chipset
"Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
5U rack-mount
Intel® 8th/9th Generation Core i9/Core i7/Corei5/Corei3/Pentium®/Celeron® series Processor., Single Socket LGA 1151 supported, CPU TDP support Up to 140W
Intel® Z390 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
"4 PCI-E 3.0 x16 slots (16/NA/16/NA or 16/NA/8/8 or 8/8/16/NA or 8/8/8/8),1 PCI-E 3.0 x1, M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1 and 1 CNVi
M.2 Form Factor: 2260/2280/22110, 2260/2280, 2230, M.2 Key: M-Key, M-Key, E-Key (RAID 0,1 support)
M.2-M1 port shares PCI-E link with U2-1 port;M.2-M2 port shares link with SATA port4 and port5; M.2-E1 port pre-installed one 802.1ac WiFi+BT5.0 module
U.2 Interface: 2 PCI-E 3.0 x4 and PCI-E 3.0 x4"
5U rack-mount
Intel® 8th/9th Generation Core i9/Core i7/Corei5/Corei3/Pentium®/Celeron® series Processor., Single Socket LGA 1151 supported, CPU TDP support Up to 140W
Intel® Z390 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
"4 PCI-E 3.0 x16 slots (16/NA/16/NA or 16/NA/8/8 or 8/8/16/NA or 8/8/8/8),1 PCI-E 3.0 x1, M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1 and 1 CNVi
M.2 Form Factor: 2260/2280/22110, 2260/2280, 2230, M.2 Key: M-Key, M-Key, E-Key (RAID 0,1 support)
M.2-M1 port shares PCI-E link with U2-1 port;M.2-M2 port shares link with SATA port4 and port5; M.2-E1 port pre-installed one 802.1ac WiFi+BT5.0 module
U.2 Interface: 2 PCI-E 3.0 x4 and PCI-E 3.0 x4"
550/1200W Redundant power supply , 80Plus Platinum
4U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors,(7003 Series Processor drop-in support requires BIOS version 2.0 or newer)*
Socket SP3, Supports CPU TDP up to 280W, Up to 128 Cores (64 per CPU)
Note :Supports 2 CPUs only – single socket not supported, Certain CPUs with high TDP may be supported only under specific conditions. Please contact TyroneTechnical Support for additional information about specialized system optimization, 4U Dual Processor (AMD), Dual-Root GPU system with 8 PCI-E GPUs.
System on Chip
2U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer),Socket SP3, Supports CPU TDP up to 280W, Up to 128 Cores (64 per CPU)
Note :Certain CPUs with high TDP may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
GPU Supports HGX A100 4-GPU 40GB (HBM2) or 80GB(HBM2e) with NVLink GPU interconnect and PCI-E Gen4 host CPUs
System on Chip
"32 DIMM slots
Up to 8TB 3DS ECC DDR4-3200MH SDRAM
Memory Type
3200MHz ECC DDR4 SDRAM"
1U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
Intel ®C621 chipset
"Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
"
2 x 3.5"" fixed drive bay
SAS or enterprise SATA HDD only recommended
"
2U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors,(7003 Series Processor drop-in support requires BIOS version 2.0 or newer)Socket SP3, Supports CPU TDP up to 280W, Up to 64 Cores
Note : Certain CPUs with high TDP higher than 225W may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
System on Chip
8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
"12 hot-swap 3.5"" Drive Bays:
12 SATA3 by default
or 8 SATA3 + 4 NVMe via optional tray
or 12 SAS3 via optional SAS kit
"
1U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
Intel® C622 chipset
"Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
2U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
Intel® C622 chipset
"Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)"
8 x 3.5" hot-swap SAS3/SATA drive bay, 2 x 3.5" fixed drive bay
3U rack-mount
Intel® 8th/9th Generation Core i9/Core i7/Corei5/Corei3/Pentium®/Celeron® series Processor., Single Socket LGA 1151 supported, CPU TDP support Up to 140W
Intel® Z390 Express
Up to 64GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 8th series and Gen 9th core i3, Pentium and Celeron) Up to 128GB Unbuffered non-ECC UDIMM, in 4 DIMM slots (Limited to Gen 9th core i5/i7/i9)
"4 x 3.5"" fixed drive bay
Optional 4 x 2.5"" fixed drive bay"
"4 PCI-E 3.0 x16 slots (16/NA/16/NA or 16/NA/8/8 or 8/8/16/NA or 8/8/8/8),1 PCI-E 3.0 x1, M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1 and 1 CNVi
M.2 Form Factor: 2260/2280/22110, 2260/2280, 2230, M.2 Key: M-Key, M-Key, E-Key (RAID 0,1 support)
M.2-M1 port shares PCI-E link with U2-1 port;M.2-M2 port shares link with SATA port4 and port5; M.2-E1 port pre-installed one 802.1ac WiFi+BT5.0 module
U.2 Interface: 2 PCI-E 3.0 x4 and PCI-E 3.0 x4"
2U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
Socket SP3, Up to 240W TDP
Up to 32 Cores
Up to 64 Cores (Board revision 2.x required)"
System on Chip
2U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
Socket SP3, Up to 240W TDP
Up to 32 Cores
Up to 64 Cores (Board revision 2.x required)"
System on Chip
2U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
Socket SP3, Up to 240W TDP
Up to 32 Cores
Up to 64 Cores (Board revision 2.x required)"
System on Chip
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
12 x 3.5" hot-swap drive bay, optional 2 x 2.5" hot-swap drive bay
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
12 x 3.5" hot-swap drive bay, optional 2 x 2.5" hot-swap drive bay
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
36 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
4U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Up to 64 Cores
System on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
4U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Up to 64 Cores
System on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
1U Racdkmount
Dual AMD EPYC™ 7003/7002 Series Processors (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) Socket SP3, Supports CPU TDP up to 280W*
Up to 64 Cores
Note * Certain CPUs with high TDP may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
System on Chip
"32 DIMM slots, Supports up to 8TB Registered ECC DDR4 3200MHz SDRAM
8-channel memory bus
For Dual CPUs: Recommended that memory be populated equally in adjacent memory banks
"
12 Hot-swap 2.5" U.2 NVMe drive bays
"WIO:1 PCI-E 4.0 x32 Left Riser Slot, 1 PCI-E 4.0 x16 Right Riser Slot Ultra:1 PCI-E 4.0 x40 Far Right Riser Slot
"
1200W Redundant Power Supplies Titanium Level (96%)
2U Rackmount
"Single AMD EPYC™ 7001/7002* series Processor (*Board revision 2.x required) Socket SP3
Cores: Up to 32 Cores, Up to 64 Cores (Board revision 2.x required)"
System on Chip
"DIMM slots
Supports up to 1TB Registered ECC DDR4 2666MHz SDRAM in 8 DIMMs
Supports up to 2TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.x required)
8-channel memory bus
Memory Type:
DDR4 2666 MHz Registered ECC, 288-pin gold-plated DIMMs
DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs (Board revision 2.x required)
"
12 x 3.5" hot-swap SAS/SATA drive bay with SES3, Optional 2 x 2.5" hot-swap drive bays
2U Rackmount
10th Generation Intel® Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® Processor
Single Socket LGA-1200 (Socket H5) supported, CPU TDP support Up to 140W TDP
Intel® Z490
Up to 128GB Unbuffered non-ECC UDIMM, DDR4-2933MHz, in 4 DIMM slots 2933 MHz to 4000+MHz(OC) in four 288-pin memory slots.
8 x 3.5"" hot-swap SAS3/SATA drive bay
2 x 3.5"" fixed drive bay
Tower/Convertible/5U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
Socket SP3, Up to 240W TDP
Cores :Up to 32 Cores, Up to 64 Cores (Board revision 2.x required)
"
System on Chip
"
16 DIMM sockets
Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM
Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.x required)
8-channel memory bus
"
"External 5.25"" x 4, 3.5"" x 1
• Internal 2.5""/3.5"" x 5"
"3 PCI-E 3.0 x8, 2 PCI-E 3.0 x16
M.2 , Interface: 1 SATA/PCI-E 3.0 x2 (Platform with EPYC 7002 processor only supports PCI-E type M.2 module)
Form factor: 2280, 22110
Key: M-key
"
Tower/Convertible/5U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
Socket SP3, Up to 240W TDP
Cores :Up to 32 Cores, Up to 64 Cores (Board revision 2.x required)
"
System on Chip
"
16 DIMM sockets
Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM
Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.x required)
8-channel memory bus
"
"External 5.25"" x 4, 3.5"" x 1
• Internal 2.5""/3.5"" x 5"
"3 PCI-E 3.0 x8, 2 PCI-E 3.0 x16
M.2 , Interface: 1 SATA/PCI-E 3.0 x2 (Platform with EPYC 7002 processor only supports PCI-E type M.2 module)
Form factor: 2280, 22110
Key: M-key
"
550 / 1200W Redundant power supply ,80 Plus platinum
1U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Supports CPU TDP up to 280W, Up to 64 Cores
Note : Certain CPUs with high TDP higher than 225W may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
System on Chip
1U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor , (7003 Series Processor drop-in support requires BIOS version 2.0 or newer),Socket SP3, Support CPU TDP up to 280W,Up to 64 Cores
System on Chip
"16 DIMM slots, Up to 4TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM
Memory Type: DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs"
10 Hot-swap U.2 Gen4/Gen3 NVMe drive support, Optional 10 SATA3 drive support via additional SATA cables
2U Rackmount
"Dual Socket P (LGA 3647)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
3 UPI up to 10.4GT/s
Support CPU TDP 70-165W
Cores
Up to 28 Cores
Note: ‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)"
Intel® C621 chipset
"24 DIMM slots
Up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
Memory Type : 2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Tyrone
†† Cascade Lake only. Contact your Tyrone sales rep for more info"
Tower/Convertible/5U Rackmount
"10th Generation Intel® Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® Processor
Single Socket LGA-1200 (Socket H5) supported, CPU TDP support Up to 140W TDP"
Intel® Z490
"Up to 128GB Unbuffered non-ECC UDIMM, DDR4-2933MHz, in 4 DIMM slots
2933 MHz to 4000+MHz(OC) in four 288-pin memory slots.
"
"External 5.25"" x 4, 3.5"" x 1
• Internal 2.5""/3.5"" x 5"
Tower/Convertible/5U Rackmount
"10th Generation Intel® Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® Processor
Single Socket LGA-1200 (Socket H5) supported, CPU TDP support Up to 140W TDP"
Intel® Z490
"Up to 128GB Unbuffered non-ECC UDIMM, DDR4-2933MHz, in 4 DIMM slots
2933 MHz to 4000+MHz(OC) in four 288-pin memory slots.
"
"External 5.25"" x 4, 3.5"" x 1
• Internal 2.5""/3.5"" x 5"
Tower/Convertible/5U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Up to 64 Cores
System on Chip
"8 DIMM slots
Supports up to 2TB Registered ECC DDR4 3200MHz SDRAM
8-channel memory bus
"
"External 5.25"" x 4, 3.5"" x 1
• Internal 2.5""/3.5"" x 5"
4U Rackmount/Tower
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
"
"
8 x 3.5"" hot-swap SAS/SATA drive bay with SGPIO
"
4U Rackmount
""Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
"
Intel® C621A Chipset
12x DIMM slots supporting up to 1,536GBMemory, Supports Intel Optane DC Persistent Memory Module (DCPMM)
"
8x 3.5"/2.5" hot-swap SAS drive bay with SES3. Peripheral bays : 3x standard 5.25" drive bay
"
2U Rackmount
"2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s"
Intel® C622
" Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz
Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only"
"
24 x 2.5"" hot-swap SAS/SATA drive bay
Optional 2 x 2.5"" hot-swap drive bay
"
2U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Support CPU TDP / cTDP up to 225W, Up to 64 Cores
Note * Certain CPUs with high TDP may be supported only under specific conditions. Please contact Tyrone Technical Support for additional information about specialized system optimization
System on Chip
4U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor(7003 Series Processor drop-in support requires BIOS version 2.0 or newer) Socket SP3, Up to 64 Cores
System on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
8x 3.5" SAS3/SATA3 Backplane for Hot-Swappable Drives
2U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor(7003 Series Processor drop-in support requires BIOS version 2.0 or newer) Socket SP3, Up to 64 Cores
System on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
"
12 x 3.5"" hot-swap SAS/SATA drive bay with SES3
Optional 2 x 2.5"" hot-swap drive bay
"
2U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor(7003 Series Processor drop-in support requires BIOS version 2.0 or newer) Socket SP3, Up to 64 Cores
System on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
"
8 x 3.5"" hot-swap SAS3/SATA drive bay
2 x 3.5"" fixed drive bay
"
4U Rackmount
Dual AMD EPYC™ 7003/7002 Series Processors (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Supports CPU TDP up to 280W, Up to 128 Cores (64 per CPU)
System on Chip (SoC
s
8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
"6 Hot-swap U.2 NVMe 2.5"" drive bays
(4 via PCI-E switch, 2 via CPU ) "
" 8 PCI-E 4.0 x16 via PCI-E switch;
1 PCI-E 4.0 x 16 LP and 1 PCI-E 4.0 x8 LP via CPUs;
AIOM Support "
2200W Redundant Power Supply / 3000W Redundant Power Supply
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
"8 x 3.5"" hot-swap SAS3/SATA drive bay, 2 x 3.5"" fixed drive bay
"
4U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor(7003 Series Processor drop-in support requires BIOS version 2.0 or newer) Socket SP3, Up to 64 Cores
System on Chip
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
8 x 3.5/2.5" Hot-swap SSD/HDDs
SAS 12Gb/s /SATA 6Gb/s /NVMe Backplane Support
4U Rackmount
Single AMD EPYC™ 7003/7002 Series Processor(7003 Series Processor drop-in support requires BIOS version 2.0 or newer) Socket SP3, Up to 64 Cores
System on Chip
2U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s"
Intel® C621 chipset
"Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);"
2U Rackmount
" Dual Socket P (LGA 3647)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
Dual UPI up to 10.4GT/s
Support CPU TDP 70-140W
"
Intel® C621 chipset
"8 DIMMs; up to 2TB 3DS ECC
DDR4-2933MHz† RDIMM/LRDIMM "
6 Hot-swap 3.5" SATA3 drive bays
"2 PCI-E 3.0 x8 (FH/HL) or 1 PCI-E 3.0
x8 (FH/HL) + 1 PCI-E 3.0 x4 (FH/HL)
+ 1 PCI-E 3.0 x 4 (LP) (8/8/0 or 8/4/4)"
"Up to 1200W Redundant Power Supplies
Titanium Level (96%)"
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V
DDR4-2933 speed only supported with 2nd Gen Intel Xeon Scalable Processor and in a 1 DIMM per channel configuration / Intel Optane DC Persistent Memory Module (DCPMM) only supported with specific 2nd Gen Intel Xeon Scalable Processor"
16 x 3.5" hot-swap SAS3/SATA drive bay, optional 2 x 2.5" hot-swap SAS3/SATA drive bay
2U Rackmount
"2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 140W TDP, 2 UPI up to 10.4 GT/s"
Intel® C621
"Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
"
"8 x 3.5"" hot-swap SAS3/SATA drive bay
2 x 3.5"" fixed drive bay
"
2U rack-mount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s"
Intel® C622
"Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);"
12 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
12 x 3.5" hot-swap drive bay, optional 2 x 2.5" hot-swap drive bay
1U Rackmount
"Single AMD EPYC™ 7001/7002* series Processor (*Board revision 2.x required) Socket SP3
Supports CPU TDP 225W / cTDP up to 240W*
"
System on Chip (SoC)
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
"
8 x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay
Optional 2 x 3.5"" fixed drive bay
Optional 2 x 2.5"" hot-swap SAS3/SATA drive bay
"
2U rack-mount
"2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
"
Intel® C621
"
8 x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay
Optional 2 x 3.5"" fixed drive bay
Optional 2 x 2.5"" hot-swap SAS3/SATA drive bay
"
4U Rackmount
"Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required), Socket SP3
Cores Up to 32 Cores Up to 64 Cores (Board revision 2.x required)
"
System on Chip
2U Racdkmount
Dual AMD EPYC™ 7003/7002 Series Processors, (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Supports CPU TDP up to 280W, Up to 64 Cores
System on Chip
32 DIMM slots, Supports up to 8TB Registered ECC DDR4 3200MHz SDRAM, 8-channel memory bus
"24 hot-swap 2.5"" U.2 NVMe drive bays
Up to 24 SAS/SATA drives supported via optional SAS kit
"
2U Rackmount
"Quad Socket P (LGA 3647)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
3 UPI up to 10.4GT/s
Support CPU TDP up to 205W
"
Intel® C621
"48 DIMMs; up to 12TB 3DS ECC
DDR4-2933MHz† RDIMM/LRDIMM,
Supports Intel® Optane™ DCPMM"
2U Rackmount
EATX Server Board with dual Xeon Scalable processors
Intel C622
DDR4 2666 MHz RDIMM up to 768 GB (24 DIMMs)
"8 x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay Optional 2 x 3.5"" fixed drive bay
Optional 2 x 2.5"" hot-swap SAS3/SATA drive bay
"
5 PCIe x16 (Gen3) and one PCIe x8 (Gen3) for three double-deck cards
2U Rackmount
"2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s"
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
"
12 x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay with SES3
Optional 2 x 2.5"" hot-swap drive bay
"
4U Rackmount/Tower
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
"
4 x 3.5"" fixed drive bay
Optional 4 x 2.5"" fixed drive bay
"
2U Rackmount
"Single EPYC™ 7003/7002 Series Processor
(7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
Socket SP3, Supports CPU TDP up to 280W"
System on Chip (SoC)
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
2 front Hot-swap 2.5" U.2 NVMe Gen4 drive bays
"
6 PCI-E Gen 4 x16 (4 internal, 2 external) slots
1 PCI-E Gen 4 x16 AIOM networking slot
"
"2600W Redundant (1+1) Power Supplies
Titanium Level (96%)"
2U Rackmount
"Single AMD EPYC™ 7002/7003 Series Processor, Socket SP3, Supports CPU TDP up to 280W,Up to 64 Cores
"
System on Chip
"
16 DIMM slots
Up to 4TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM
"
"12 Hot-swap 3.5"" drive bays:
12 SATA3 by default
or 8 SATA3 + 4NVMe via optional cables
or 12 SAS3 via via optional SAS kit
Optional 2x 2.5"" peripheral drive support via additional rear drive bays kits
"
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
12x DIMM slots supporting up to 1,536GBMemory, Supports Intel Optane DC Persistent Memory Module (DCPMM)
24 x 2.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay
4U Rackmount
"Dual Socket P+ (LG-4189), 3rd Gen Intel® Xeon® Scalable processors
3 UPI up to 11.2GT/s, Support CPU TDP 270W
"
Intel® C621A
"16 DIMM Slots;
Up to 4TB DRAM;
Up to 4TB Intel® Optane™ Persistent Memory (up to 6TB with DRAM) ;
3200/2933/2666 ECC DDR4 LRDIMM;RDIMM;
Intel® Optane™ Persistent Memory 200 series"
8x 3.5" hot-swap NVMe/SATA/SAS Support drive bays 2 M.2 NVMe OR 2 M.2 SATA3
1U Rackmount
"Dual Socket P+ (LG-4189)
3rd Gen Intel® Xeon® Scalable processors, 3 UPI up to 11.2GT/s
Support CPU TDP 220W
"
"Intel® C621A
"
"16 DIMM Slots;
Up to 4TB DRAM;
Up to 4TB Intel® Optane™ Persistent Memory (up to 6TB with DRAM) ;
3200/2933/2666 ECC DDR4 LRDIMM;RDIMM;
Intel® Optane™ Persistent Memory 200 series"
4U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
Intel® C622
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
8x 3.5"/2.5" SAS/SATA Backplane for Hot-Swappable Drives
4U Rackmount
"2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 140W TDP, 2 UPI up to 10.4 GT/s"
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
"
36 x 3.5"" hot-swap SAS/SATA drive bay with SES3
Optional 2 x 2.5"" hot-swap drive bay
"
2U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s"
Intel® C621A
"Up to 4TB RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slotsP1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 series only."
"4U Tower Rackmount
"
"Dual Socket P+ (LGA-4189)
3rd Gen Intel® Xeon® Scalable processors, Support CPU TDP 270W ,Up to 40C/80T; Up to 60MB Cache
"
Intel® C621A Chipset
16 DIMM slots, UP to 4TB: 16x 256 GB DRAM, UP to 6TB: 8x 256 GB DRAM and 8x 512 GB PMem, Memory Type: 3200MHz ECC DDR4 RDIMM, LRDIMM, Intel® Optane™ persistent memory 200 series
2U Rackmount
"Dual Socket E (LGA-4677)
4th Gen Intel® Xeon® Scalable processors, Intel Xeon CPU Max Series with high bandwidth memory (HBM), Up to 60C/120T; Up to 112.5MB Cache
Note: Supports up to 350W TDP CPUs (Air Cooled)
Intel® C741 chipse"
Slot Count: 32 DIMM slots/16 Channels, Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM
2U Rackmount
"Dual Socket E (LGA-4677)
4th Gen Intel® Xeon® Scalable processors
Intel Xeon CPU Max Series with high bandwidth memory (HBM)
Note : Supports up to 350W TDP CPUs (Air-Cooled)
Supports up to 350W TDP CPUs (Liquid-Cooled" Intel® C741 chipset
"
32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-4800
"
2U Rackmount
"Dual Socket E (LGA 4677)
4th Gen Intel® Xeon® Scalable processors, Intel Xeon CPU Max Series with high bandwidth memory (HBM), Up to 32C/64T; Up to 112.5MB Cache" Intel® C741
"
Memory Capacity: 16 DIMM slots
Up to 4TB: 16x 256 GB DRAM
Memory Type: 4800MHz ECC DDR5 RDIMM
"
2U Rackmount
"Dual Socket P+ (LGA 4189)
3rd Gen Intel® Xeon® Scalable processors ,Up to 32C/64T; Up to 48MB Cache per CPU, Supports up to 185W TDP CPUs (Air Cooled)" "
Intel® C621A chipset
"
16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
6x 2.5" hot-swap SATA/SAS drive bays
"
1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm)"
"2U Rackmount
"
"2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s"
Intel® C621
"4U Rackmount
"
"2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s"
Intel® C621
2U Rackmount
"Single AMD EPYC™ 7003/7002 Series Processor
(7003 Series Processor drop-in support requires BIOS version 2.0 or newer) "
"
System on Chip
"
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
16 x 3.5" hot-swap SAS3/SATA drive bay, optional 2 x 2.5" hot-swap SAS3/SATA drive bay
7 low-profile expansion slot(s)
1600W Redundant Titanium AC Power Supply with PMbus 73.5x203x40mm
2U Rackmount
"Single AMD EPYC™ 7003/7002 Series Processor
(7003 Series Processor drop-in support requires BIOS version 2.0 or newer) "
"
System on Chip
"
2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
12 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
7 low-profile expansion slot(s)
1200W/1000W Titanium Power Supply W/PMbus W76xL336xH40mm
4U Rackmount
"Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Support CPU TDP 270W
"
"
Intel® C621A
"
"
Memory Capacity: 16 DIMM slots
UP to 4TB: PMem and DRAM
Memory Type: 3200MHz ECC LRDIMM/RDIMM DDR4
Intel® Optane™ persistent memory 200 series
"
8x 3.5" hot-swap SATA3 drive bays (8x 3.5" hot-swap SATA drive bays can be converted to 8x SAS drive bays by adding 1x AOC-S3108L-H8IR or AOC-S3108L-H8IR-16DD + 2x CBL-SAST-0531-01)
"4 PCI-E 4.0 x16 Full Height (FH)
2 PCI-E 4.0 x8 Full Height (FH)"
1200W Redundant Power Supply / 1200W High-Efficiency Power Supply.
4U Rackmount
"
Dual Socket P+ (LG-4189)
3rd Gen Intel® Xeon® Scalable processors
Support CPU TDP 120-270W
"
Intel® C621A
"
Memory Capacity: 16 DIMM slots
UP to 4TB: PMem and DRAM
Memory Type: 3200MHz ECC LRDIMM/RDIMM DDR4
Intel® Optane™ persistent memory 200 series
"
8x 3.5" hot-swap SATA3 drive bays (8x 3.5" hot-swap SATA drive bays can be converted to 8x SAS drive bays by adding 1x AOC-S3108L-H8IR or AOC-S3108L-H8IR-16DD + 2x CBL-SAST-0531-01)
"4 PCI-E 4.0 x16 Full Height (FH)
2 PCI-E 4.0 x8 Full Height (FH)"
1200W Redundant Power Supplies Titanium level 100-240Vac and 200-240 Vdc, Whisper-Quiet
Tower/5U Rackmount
3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
Intel® C621A
"Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 8 DIMM slots"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
Tower/5U Rackmount
3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
Intel® C621A
"Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 8 DIMM slots"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
Dual LAN with Intel® i350 Gigabit Ethernet Controller” to “Dual 10GBase-T LAN with Intel® X550 Ethernet Controller or Dual Gigabit LAN with Intel® i350 Ethernet Controller
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slotsP1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 Series only."
"
12 x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay with SES3
Optional 2 x 2.5"" hot-swap drive bay
"
2U Rackmount
"Dual Socket P+ (LGA 4189)
3rd Gen Intel® Xeon® Scalable processors
Support CPU TDP 185W ,Up to 32C/64T; Up to 48MB Cache"
Intel® C621A chipset
16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
4U Rackmount
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
24x 3.5" hot-swap SAS/SATA drive bays supporting SAS3/2 or SATA3 HDDs with 12Gbps throughput
"2 PCI-E 3.0 x8 (in x16),3 PCI-E 3.0 x8,1PCI-E 3.0 x4 (in x8),1 PCI-E 3.0 x4 (occupied by HBA card)
"
1200W/1000W Titanium Power Supply W/PMbus W76xL336xH40mm
4U Rackmount
"
Dual Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors,supports up to 300W TDP
"
Intel C741
"
16 DIMM slots, Up to 4TB DDR5-4800MHz ECC Registered RDIMM
"
8x 3.5" hot-swap SATA3 drive bays (Configurable option for 8 hot-swap SAS or 4x hot-swap NVMe drive bays. NVMe or SAS support requires additional parts. Please see the Optional Parts list)
2U Rackmount
"Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors
CPU TDP supports Up to 270W TDP
3 UPI up to 11.2 GT/s"
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz, Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
- Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slots (P1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane Persistent Memory 200 Series only)"
16x 2.5" hot-swap drive bays (8x SAS drive bays with Broadcom® 3908 HW RAID controller(backplane port# 0~7) and 8x SATA drive bays (backplane port# 8~15) with Intel® C621A (4x SATA drive bays (backplane port# 8~11) can be converted to NVMe drives with optional 2x CBL-SAST-0821-1)
Tower/5U Rackmount
"3rd Gen Intel® Xeon® Scalable processors, Intel® Xeon® W-3300 Processor
Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP"
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory, DDR4-3200MHz, in 16 DIMM slots"
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
"4 PCI-E 4.0 x16,
3 PCI-E 4.0 x8 (in x16 slot)
M.2 Interface: 4 PCI-E 4.0 x4
M.2 Form Factor: 2260/2280/22110
M.2 Key: M-Key
M.2 support to RAID 0,1, 5, 10, VROC key is required for RAID."
550/1200W Redundant Power Supply Optional : 500/1200W Single Power Supply
Mid tower
"
3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
"
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 6TB Intel® Optane™ Persistent Memory, DDR4-3200MHz, in 16 DIMM slots;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode."
"4 x 3.5"" fixed drive bay Optional 4 x 2.5"" fixed drive bay
"
Mid tower
"
3rd Gen Intel® Xeon® Scalable processors, Intel® Xeon® W-3300 Processor
Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
"
Intel® C621A
"
Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory, DDR4-3200MHz, in 16 DIMM slots"
Tower/Convertible/5U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
Intel C622
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s"
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
"8 x 3.5"" hot-swap SAS3/SATA drive bay, 2 x 3.5"" fixed drive bay
"
2U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
Intel® C622
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
"12x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay with SES3
Optional rear 2x 2.5"" hot-swap drive bay kit"
"1 PCI-E 3.0 x16,1 PCI-E 3.0 x16 (x16 or x8 ),1 PCI-E 3.0 x8 (x0 or x8 ),1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8 slot)
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280, 22110
Key: M-Key
Double Height Connector
"
"
Memory Capacity: 32 DIMM slots
Up to 8TB: 32x 256 GB DRAM
Up to 12TB: 16x 512 GB PMem and 16x 256 GB DRAM
Memory Type: 3200/2933/2666MHz ECC DDR4 RDIMM;LRDIMM
Intel® Optane™ persistent memory 200 series
"
4U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s"
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
36 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
2U Rackmount
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
Intel® C622
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
"2x 3.5"" fixed drive bay
8x 3.5"" hot-swap SAS3/SATA drive bay
"
2U Rackmount
Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors
Intel® C621A
16 DIMM slots (16 DRAM + 4 PMem Up to 4TB: 16x 256 GB DRAM
Up to 6TB: 8x 256 GB DRAM and 8x 512 GB PMem
Memory Type: 3200MHz ECC DDR4 RDIMM
Intel® Optane™ persistent memory 200 series
2U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s"
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
12 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
1U Rackmount
Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP.
"
Intel® C621A
"
8 DIMM slots
Up to 2TB: 8x 256 GB DRAM
Up to 3TB: 4x 256 GB DRAM and 4x 512 GB PMem
Memory Type: 3200/2933/2666MHz ECC DDR4 RDIMM;LRDIMM
Intel® Optane™ persistent memory 200 series
10x hot-swap 2.5'' SATA3 drive bays with 4 hybrid NVMe/SATA drive bays, SAS3 with additional SAS controller card; Onboard 1x NVMe/SATA M.2
1U Rackmount
"Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors
Support CPU TDP 270W, CPUs with TDP higher than 185W may have support conditions due to power and thermal limitations.
"
Intel® C621A chipset
Memory Capacity: 16 DIMM slots, Up to 4TB: 16x 256 GB DRAM, Up to 6TB: 8x 256 GB DRAM and 8x 512 GB PMem
Memory Type: 3200/2933/2666MHz ECC DDR4 RDIMM;LRDIMM
Intel® Optane™ persistent memory 200 series
4U Rackmount
"
Single Socket P+ (LGA 4189)
Support Intel® 3rd Gen Xeon® Scalable Processors
Support CPU TDP 270W
"
Intel® C621A chipset
"Memory Capacity: 8 DIMM slots
Up to 2TB: 8x 256 GB DRAM
Up to 3TB: 4x 256 GB DRAM and 4x 512 GB PMem
Memory Type: 3200/2933/2666MHz ECC DDR4 RDIMM;LRDIMM"
2U Rackmount
Dual Socket P (LGA 3647)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
3 UPI up to 10.4GT/s
Support CPU TDP 70-205W*
Intel® C621 chipset
24 DIMM slots
Up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
6 Hot-swap 2.5" NVMe drive bays
2 PCI-E 3.0 (x16) Low-profile slots
1 SIOM card support
(must bundle with network card)
2600W Redundant Power Supplies
Titanium Level (96%)
1U Rackmount
"Single Socket H5 (LGA 1200)
Support Intel® Xeon® E-2300 series Processors and 10th Gen. Pentium® Processors
Support CPU TDP 95W"
Intel® C256
4 DIMMs; Up to 128GB of DDR4 ECC UDIMM memory with speeds of up to 3200MHz
Tower/Convertible/5U Rackmount
12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9 Processors, Single Socket LGA-1700 (Socket V0) supported, CPU TDP supports Up to 150W TDP
Intel® W680
128GB Unbuffered ECC/non-ECC UDIMM, DDR5-4400MHz, in 4 DIMM slots
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s"
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
24 x 2.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay
4U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s"
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
5U rack-mount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s"
Intel® C621A
"Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slotsP1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 Series only."
5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
2U Rackmount
"Intel Xeon Scalable Processor / 2nd Gen Intel Xeon Scalable Processor,
Max up to 205W,Up to 10.4/9.6 GT/s with Intel UltraPath Interconnect (UPI) support"
Intel® C621
"(6)+(6) DIMM slots
DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2933/2666 / Intel
Optane DC Persistent Memory Module (DCPMM)
Up to 384GB RDIMM / 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS
6 Channels per CPU
1.2V"
16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay
4U Rackmount
"Single AMD EPYC™ 7003/7002 Series Processor
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
Socket SP3"
System on Chip
Tower/5U Rackmount
"3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s"
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
External: 5.25" x 4, 3.5" x 1; Internal: 3.5" x 5 or 2.5" x5
Tower or 5U Rackmount
Dual Socket E (LGA-4677) 4th Generation Intel® Xeon® Scalable Processors (Note : Certain CPU SKUs are conditionally supported, please contact Tyrone Technical Support for additional information about specialized system optimization)Intel C741
Memory Capacity: 16 DIMM slots Up to 2TB: 16x 128 GB DRAM Memory Type: 4800MHz ECC DDR5 RDIMM
Drive Bays : Total 4 bay(s) 4 front hot-swap 3.5" NVMe/SAS*/SATA drive bay(s)
Tower/5U
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Intel® Xeon® W-32xx Processor, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, Up to 28 cores Intel® C621
12 DIMM slots
Up to 3TB Intel® Optane™ Persistent Memory 200 Series, DDR4-2666MHz
Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz
Xeon-W 32xx supports up to 2TB 3DS ECC RDIMM/LRDIMM, Xeon-W 32xx supports up to 1TB 3DS RDIMM/LRDIMM. Xeon-W32xx series processors don't support DCPMM, Memory Type -ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
External-2.5"/3.5" hot-swap trays x 12 (pre-installed x 8), 5.25" x 1
4 PCIe 3.0 x16,
3 PCIe 3.0 x8 (in x16 slot),
PCIex16 Slot#1 shares with M.2, Slot#2 shares with Slot#3(NA/16,8/8), Slot#4 shares with Slot#5(NA/16,8/8), Slot#6 shares with Slot#7(NA/16,8/8)
(16/NA/16/NA/16/NA/16 or 16/8/8/8/8/8/8)
(16/NA/16/NA/16/NA/16 or 16/8/8/8/8/8/8), M.2 Interface: 4 PCIe 3.0 x4, RAID 0 & 1, Form Factor: 2242/2260/2280/22110
Key: M-Key, M.2 support RAID 0,1(up to RAID 5, 10), VROC key is required for Raid.
800W/1200W/1600W/2000W, 80 Plus Platinum power supply
Tower
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Intel® C621
16 DIMM slots
Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC RDIMM,DDR4-2933MHz
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
External 2.5"/3.5" hot-swap trays x 12 (pre-installed x 8), 5.25" x 1
