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  Hyperscale / Hyperconverged, HPC and Big Data, Data Center Enterprise Applications, Scale-Out Storage, Virtualization Server, Telco Data Center
• Eight hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following:
• Socket P+(LGA 4189) Supports 3rd Generation Intel® Scalable Processors (Dual Socket)
• 16 DIMMs Supports up to 4TB Intel® Optane Persistent Memory 200 Series; up to 2TB DDR 4-3200, Two M.2 Internal Drives
• Network Connectivity Via AIOM (OCP 3.0 Compliant) , NVMe/SATA/SAS options
• AIOM and M.2 support; 1 AIOM card support (PCIe 4.0)
• Front access node for better serviceability; 6x 2.5” hot-swap HDDs per node, Up to 6x SAS/SATA/NVMe Hot Swap 2.5” Drives
• Fans : 3x 4cm Fan(s)
• 8800W Redundant Titanium Level power supplies
 


Processor/Cache
Processor
Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 36C/72T; Up to 54MB Cache per CPU
Chipset
Chipset Intel® C621A Chipset
System Memory
Memory Capacity 16 DIMMs Supports up to 4TB Intel® Optane Persistent Memory 200 Series; up to 2TB DDR 4-3200 , Two M.2 Internal Drives
Expansion Slots
PCI-Express 1 PCIe 4.0 x8 LP slot(s)
Integrated On-Board
SATA 14 SATA (6Gbps) port(s)
NVME 6 NVMe U.2 options
LAN 1 RJ45 Dedicated IPMI LAN port
Add-on Options
Raid Card None
Optical Drive None
Front Panel
LED HDD activity LEDNetwork activity LEDs, Power status LED, Universal Information (UID) LED
Buttons Power On/Off button,UID button
Drive bays
HDD Bays 6x 2.5" hot-swap NVMe/SATA/SAS drive bays (6x 2.5" NVMe hybrid), 6x 2.5" 7mm drive bays
Power Supply
Power Supply 8800W Redundant Titanium Level power supplies
Cooling System
Fans 3x 4cm Fan(s)
Form Factor
Form Factor 4U Rackmount
Dimensions
Dimensions Height - 6.96" (177mm), Width - 17.63" (448mm), Depth -29" (737mm)"

Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners

 
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