Application and data serving,Connectivity/Storage Compute Nodes,High Availability Storage Appliance Platform
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2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP
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Intel® C622 chipset
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Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN
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3 High-performance 80mm PWM fans
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800W Redundant Power Supplies Titanium Level (96%)
Processor/Cache
Processor
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP
Chipset
Chipset
Intel® C622 chipset
System Memory
Memory Capacity
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners