2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
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Intel® C622
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Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
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M.2 NGFF connector, M.2 Interface: PCI-E 3.0 x4 and SATA, Form Factor: 2280, 22110, Key: M-Key, Double Height Connector
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"Optional 2x 2.5"" hot-swap drive bay, 12x 3.5"" (tool-less) or 2.5"" (screw) hot-swap SAS3/SATA drive bay with SES3
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"3x 8cm high-performance PWM fan(s)
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600W / 650W Redundant Power Supply
Processor/Cache
Processor
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
Chipset
Chipset
Intel® C622
System Memory
Memory Capacity
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
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