Artificial Intelligence ,Big Data Analytics ,High-performance Computing, Research Lab/National Lab ,Astrophysics, Business Intelligence
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2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
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Intel® C621 chipset
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Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots (2933MHz in two DIMMs per channel supported on Rev 1.10 MB only) ;Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
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4 PCI-E 3.0 x16 (LP) (GPU tray for GPUDirect RDMA), 2 PCI-E 3.0 x16 (LP, CPU tray)
2200W Redundant (2+2) Power Supplies; Titanium Level (96%+)
Processor/Cache
Processor
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Chipset
Chipset
Intel® C621 chipset
System Memory
Memory Capacity
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots (2933MHz in two DIMMs per channel supported on Rev 1.10 MB only) ;Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Expansion Slots
PCI-Express
4 PCI-E 3.0 x16 (LP, GPU tray for GPUDirect RDMA) slots,2 PCI-E 3.0 x16 (LP, CPU tray) slots or up to 8x 2.5" NVMe Storage Devices
Integrated On-Board
SATA
SATA3 (6Gbps) with RAID 0, 1, 5, 10
LAN
2 RJ45 10GBase-T LAN ports, 1 RJ45 Dedicated IPMI LAN port
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
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