2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Chipset
Chipset
Intel® C622
System Memory
Memory Capacity
up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz in 16 DIMMs, 8x DIMMs reserved for Optane Persistent Memory only
Expansion Slots
PCI-Express
" PCIe Gen4, x36, riser 1, x28 riser 2 32 lanes to Examaxconnector for hot swap support of storage"
Integrated On-Board
Ethernet
Integrated 10Gbase-T RJ45 network & 1Gbase-T RJ45 management per node
Add-on Options
Raid Card
Optional
Drive bays
HDD bays
Up to 24x U.2 NVMeSSDs (6 per node ) Optional : Up to 32x E1.L NVMeSSDs (8 per node)
Power Supply
Power Supply
4x hot-swap CRPS 2100W (Platinum) or 2700W (Titanium) PSUs
Form Factor
Form Factor
3U Rackmount
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
Products 
