2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
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Intel® C621
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Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
External - 2.5"/3.5" hot-swap trays x 12 (pre-installed x 8), 5.25" x 1, Internal - 2.5" x 2 or 3.5" x 1
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Middle: 92 x 25mm PWM fan x 3, Rear: 120 x 25mm PWM fan x 1
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800W/1200W/1600W/2000W , 80 plus platinum power supply
Processor/Cache
Processor
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s
Chipset
Chipset
Intel® C621
System Memory
Memory Capacity
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
External - 2.5"/3.5" hot-swap trays x 12 (pre-installed x 8), 5.25" x 1, Internal - 2.5" x 2 or 3.5" x 1
Power Supply
Power Supply
800W/1200W/1600W/2000W , 80Plus Platinum Power supply
Cooling System
Cooling System
Middle: 92 x 25mm PWM fan x 3, Rear: 120 x 25mm PWM fan x 1
Form Factor
Form Factor
Tower
Dimensions
Dimensions
(DxWxH; Chassis Only), 589.7 x 200 x 430mm, (23.22" x 7.87" x 16.93")
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
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