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  Key features
• 1U UP CloudDC with 10 hot-swap 2.5" NVMe/SAS/SATA bays and 2 PCIe 5.0 slots + 2 PCIe 5.0 AIOM slots
• Virtualization, HPC, CDN, Edge Nodes, Cloud Computing, Data Center Optimized, Storage Headnode
• Single Socket E (LGA-4677) 4th/5th Gen Intel® Xeon® Scalable processors. Up to 350W TDP
• Intel C741 Chipset
• 16 DIMMs; Supports 3DS DDR5 RDIMM. Up to 5600 MHz
• 2 PCIe 5.0 x16 FHHL slot(s), 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
• Dual AIOM (OCP 3.0) for networking (NCSI available), 1 dedicated IPMI LAN
• 10x front hot-swap 2.5" SATA3 drive bays (Optional all 10 hybrid Gen5 NVMe), SAS3 with additional SAS controller card
• Fans 6 middle cooling PWM 40x40x56mm Fan(s)
• 2x 800W/860W Redundant (1 + 1) Titanium Level power supplies
 

Processor/Cache
Processor
Single Socket E (LGA-4677) 4th/5th Gen Intel® Xeon® Scalable processors. Up to 350W TDP
Chipset
Chipset Intel® C741 Chipset
System Memory
Memory Capacity Memory Capacity: 16 DIMM slots, Up to 4TB: 16x 256 GB DRAM, Memory Type: 4800/4400MHz ECC DDR5 RDIMM
Expansion Slots
PCI-Express 2 PCIe 5.0 x16 FHHL slot(s), 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
Integrated On-Board
SATA: SATA (6Gbps) ; RAID 0/1/5/10 support
LAN: 1 RJ45 Dedicated IPMI LAN port
Add-on Options
Raid Card : Optional
Optical Drive None
Front Panel
LEDs Device Activity, LAN 1 Activity, LAN 2 Activity , Power status System information.
Buttons Power On/Off UID button
Drive bays
HDD bays 10x 2.5" NVMe/SATA/SAS drive bays (10x 2.5" NVMe hybrid) 2x PCIe 3.0 x 2 M-key, 2280, 22110
Power Supply
Power Supply 2x 800W/860W Redundant (1 + 1) Titanium Level power supplies
Cooling System
Cooling System Fans : 6 middle cooling PWM 40x40x56mm Fan(s)
Form Factor
Form Factor 1U Rackmount
Dimensions: Height 1.7" (43mm), Width 17.2" (437mm), Depth 23.5" (597mm).

Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners

 
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