Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following
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Dual Socket E2 (LGA-4710), Intel® Xeon® 6 6700 series processors with E-cores Note : Supports up to 205W TDP CPUs (Air Cooled)*, Supports up to 330W TDP CPUs (Liquid Cooled) *Air Cooled CPUs with TDP over 205W only supported under specific conditions. Contact a Tyrone representative for details.
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Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC
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Flexible networking with OCP 3.0 AIOM slot
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Up to 2 PCIe 5.0 x16 LP slots, Internal PCIe 5.0 for 2x NVMe M.2 support onboard Optional 4x NVMe M.2 support onboard with built-in HW RAID1 via SCC-A2NM2241GH-B1
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Up to 6 front hot-swap 2.5"" PCIe 5.0 NVMe drive bays, M.2 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default); VROC required for RAID)
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Fans : 4x 16K RPM Counter Rotating 80x80x56mm Fan(s) Liquid Cooling : Direct to Chip (D2C) Cold Plate (optional)
Dual Socket E2 (LGA-4710), Intel® Xeon® 6 6700 series processors with E-cores Note : Supports up to 205W TDP CPUs (Air Cooled)*, Supports up to 330W TDP CPUs (Liquid Cooled) *Air Cooled CPUs with TDP over 205W only supported under specific conditions. Contact a Tyrone representative for details.
Chipset
Chipset
System on Chip
System Memory
Memory Capacity
Slot Count: 16 DIMM slots, Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
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